Patents by Inventor Jaime Quintero

Jaime Quintero has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060210467
    Abstract: A process (40) is provided for preparing a catalyst (20). A catalyst (20) is formed over a substrate (12). A gas (24) comprising hydrogen and carbon is applied to the catalyst (20), wherein a carbon seeding layer (26) is formed on the catalyst (20). Carbon nanotubes (28) may then be grown from the catalyst (20) having the carbon seeding layer thereon (26).
    Type: Application
    Filed: March 17, 2005
    Publication date: September 21, 2006
    Inventors: Steven Smith, Bernard Coll, Jaime Quintero, Yi Wei
  • Patent number: 6992371
    Abstract: A novel device, such as a semiconductor device, a microfluidic device, a surface acoustic wave device an imprint template, or the like, including an amorphous carbon layer for improved adhesion of organic layers and method of fabrication. The device includes a substrate having a surface, an amorphous carbon layer, formed overlying the surface of the substrate, and a low surface energy material layer overlying the surface of the substrate. The device is formed by providing a substrate having a surface, depositing a low surface energy material layer and an amorphous carbon layer overlying the surface of the substrate adjacent the low surface energy material layer using plasma enhanced chemical vapor deposition (PECVD) or sputtering.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: January 31, 2006
    Assignee: Freescale Semiconductor, Inc.
    Inventors: David P. Mancini, Jaime A. Quintero, Doug J. Resnick, Steven M. Smith
  • Publication number: 20050079650
    Abstract: A novel device, such as a semiconductor device, a microfluidic device, a surface acoustic wave device an imprint template, or the like, including an amorphous carbon layer for improved adhesion of organic layers and method of fabrication. The device includes a substrate having a surface, an amorphous carbon layer, formed overlying the surface of the substrate, and a low surface energy material layer overlying the surface of the substrate. The device is formed by providing a substrate having a surface, depositing a low surface energy material layer and an amorphous carbon layer overlying the surface of the substrate adjacent the low surface energy material layer using plasma enhanced chemical vapor deposition (PECVD) or sputtering.
    Type: Application
    Filed: July 16, 2004
    Publication date: April 14, 2005
    Inventors: David Mancini, Jaime Quintero, Doug Resnick, Steven Smith