Abstract: A method and apparatus is provided for sealing lids to chip carrier assemblies that increases the efficiency and reliability of batch processing operations for integrated circuit manufacturing. A mounting fixture captively locates individual chip carriers with their covers in a recessed pocket that provides accurate lid-to-carrier positioning. A tension plate having a plurality of convex-type protrusions is mounted on the fixture that covers the chip carriers and lid assemblies such that a protrusion rest upon each chip carrier and lid assembly. A cover plate having a pattern of multiple apertures covers the fixture and tension plate. The relationship of the diameter of the apertures in the cover plate to the maximum protrusion diameter in the tension plate can control the amount of tension that the convex-shaped protrusion place on the individual chip carriers and lid assemblies for the sealing process.