Patents by Inventor Jaimie A. Mattson

Jaimie A. Mattson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140285396
    Abstract: A connector assembly for an implantable medical device with hardware components placed in established physical locations within the polymer of the connector, and a method of making the assembly. One embodiment includes a method that involves forming a first shot, coupling at least one hardware component to the first shot to form a subassembly, placing the subassembly between a set of opposing areas of a mold, moving at least one of the areas of the set of opposed areas of the mold to constrain the subassembly within the mold, and introducing a second shot over at least a portion of the subassembly to form the connector.
    Type: Application
    Filed: March 18, 2014
    Publication date: September 25, 2014
    Inventors: Nathan T. Lee, Eugene Kuschnir, Jaimie A. Mattson, David A. Bates
  • Patent number: 8673194
    Abstract: A connector assembly for an implantable medical device with hardware components placed in established physical locations within the polymer of the connector, and a method of making the assembly. One embodiment includes a method that involves forming a first shot, coupling at least one hardware component to the first shot to form a subassembly, placing the subassembly between a set of opposing areas of a mold, moving at least one of the areas of the set of opposed areas of the mold to constrain the subassembly within the mold, and introducing a second shot over at least a portion of the subassembly to form the connector.
    Type: Grant
    Filed: May 5, 2008
    Date of Patent: March 18, 2014
    Assignee: Medtronic, Inc.
    Inventors: Nathan T. Lee, Eugene Kuschnir, Jaimie A. Mattson, David A. Bates
  • Publication number: 20080303728
    Abstract: A connector assembly for an implantable medical device with hardware components placed in established physical locations within the polymer of the connector, and a method of making the assembly. One embodiment includes a method that involves forming a first shot, coupling at least one hardware component to the first shot to form a subassembly, placing the subassembly between a set of opposing areas of a mold, moving at least one of the areas of the set of opposed areas of the mold to constrain the subassembly within the mold, and introducing a second shot over at least a portion of the subassembly to form the connector.
    Type: Application
    Filed: May 5, 2008
    Publication date: December 11, 2008
    Inventors: Nathan T. Lee, Eugene Kuschnir, Jaimie A. Mattson, David A. Bates