Abstract: A wafer transport device including a robot arm, a first pin set and a mountable and dismountable C-ring. The robot arm has a first wafer carrying region. The first pin set is disposed on the robot arm and located in the first wafer carrying region. The mountable and dismountable C-ring is disposed on the first pin set and has a second wafer carrying region.

Abstract: A wafer transport device including a robot arm and a C-ring is provided. The C-ring is disposed on the robot aim. The C-ring includes a C-ring body and a staircase structure. The staircase structure is disposed on an inner side of the C-ring body. The staircase structure has a plurality of wafer carrying surfaces, and heights of the wafer carrying surfaces are gradually decreases toward an interior of the C-ring.