Abstract: Methods of forming a cutting element include leaching a diamond table of the cutting element and subsequent to leaching the diamond table of the cutting element, forming a chamfer on the diamond table of the cutting element at an interface between a cutting surface of the diamond table and an outer side surface of the diamond table. Methods of forming earth-boring tools include forming a cutting element and securing the cutting element to a body of the earth-boring tool. Forming the cutting element includes including leaching a diamond table of the cutting element and subsequent to leaching the diamond table of the cutting element, forming a chamfer on the diamond table of the cutting element at an interface between a cutting surface of the diamond table and an outer side surface of the diamond table.

Abstract: A method of making a cutting element for use on an earth-boring tool may include forming the cutting element including a cutting table formed from a superabrasive polycrystalline material. The method may further include polishing a cutting surface of the cutting table by pulsing a laser onto the cutting surface of the cutting table. The cutting element may include a superabrasive polycrystalline cutting table including a cutting surface substantially free of micro-anomalies in the superabrasive material.

Abstract: Methods of forming a cutting element include leaching a diamond table of the cutting element and subsequent to leaching the diamond table of the cutting element, forming a chamfer on the diamond table of the cutting element at an interface between a cutting surface of the diamond table and an outer side surface of the diamond table. Methods of forming earth-boring tools include forming a cutting element and securing the cutting element to a body of the earth-boring tool. Forming the cutting element includes including leaching a diamond table of the cutting element and subsequent to leaching the diamond table of the cutting element, forming a chamfer on the diamond table of the cutting element at an interface between a cutting surface of the diamond table and an outer side surface of the diamond table.

Abstract: A method of making a cutting element for use on an earth-boring tool may include forming the cutting element including a cutting table formed from a superabrasive polycrystalline material. The method may further include polishing a cutting surface of the cutting table by pulsing a laser onto the cutting surface of the cutting table. The cutting element may include a superabrasive polycrystalline cutting table including a cutting surface substantially free of micro-anomalies in the superabrasive material.

Abstract: Magnetic sample holders for abrasive operations include an array of magnets embedded in a matrix material. Each magnet of the array is positioned between about 0 mm and about 4 mm from at least one adjacent magnet of the array. Exposed surfaces of the magnets of the array are coplanar with a planar working surface of the matrix material. Methods of forming a polycrystalline diamond compact element include magnetically securing an alloy sample to an array of magnets embedded in a matrix. Each of the magnets of the array is within about 4 mm of at least one adjacent magnet of the array. A portion of the alloy sample is abraded away, and the alloy sample is positioned proximate to diamond grains and a substrate. The alloy sample, diamond grains, and substrate are subjected to a high pressure/high temperature process to sinter the diamond grains.

Abstract: Magnetic sample holders for abrasive operations include an array of magnets embedded in a matrix material. Each magnet of the array is positioned between about 0 mm and about 4 mm from at least one adjacent magnet of the array. Exposed surfaces of the magnets of the array are coplanar with a planar working surface of the matrix material. Methods of forming a polycrystalline diamond compact element include magnetically securing an alloy sample to an array of magnets embedded in a matrix. Each of the magnets of the array is within about 4 mm of at least one adjacent magnet of the array. A portion of the alloy sample is abraded away, and the alloy sample is positioned proximate to diamond grains and a substrate. The alloy sample, diamond grains, and substrate are subjected to a high pressure/high temperature process to sinter the diamond grains.