Abstract: A system to perform multi-stage cleaning of material from a space suit worn by an astronaut in a deep space environment includes one or more discharge units installed external to an interior volume of a facility in the deep space environment. Each of the one or more discharge units releases one or more substances. The one or more substances includes water or air and the interior volume of the facility is defined by an interior hatch that is separated from an exterior hatch leading to the deep space environment by an airlock. One or more collection units installed external to the interior volume. Each collection unit traps released material that is released from a space suit based on the multi-stage cleaning to prevent the released material from entering the interior volume.

Abstract: An attachment of a surface cover to a seat back in a vehicle seat having through-holes is described. A bucket seat includes a pad provided with through-holes, a surface cover configured to cover a front surface of the pad, and a back frame disposed on a back side of the pad. The back frame includes: a support portion provided with through-holes positioned to face the first through-holes, the support portion being configured to support the pad; and retaining portions provided around the through-holes and configured to retain hooks of the surface cover. The support portion and the retaining portions are integrally molded.

Abstract: An attachment of a surface cover to a seat back in a vehicle seat having through-holes is described. A bucket seat includes a pad provided with through-holes, a surface cover configured to cover a front surface of the pad, and a back frame disposed on a back side of the pad. The back frame includes: a support portion provided with through-holes positioned to face the first through-holes, the support portion being configured to support the pad; and retaining portions provided around the through-holes and configured to retain hooks of the surface cover. The support portion and the retaining portions are integrally molded.

Abstract: A vehicle is shown such as a snowmobile, where a frame includes a tunnel and a front frame portion comprised of cast halves. A suspension system is comprised of upper and lower control arms connected to the front frame portion. Some of the frame components are adhesively fixed together. A powertrain is supported by the frame, and is comprised of an engine and a clutch. The clutch includes a clutch guard supporting an oil container. The engine has an exhaust system which extends through the front frame portion. The snowmobile also has a rear snow deflector.

Abstract: Signals are routed to and from identical stacked integrated circuit dies by selectively coupling first and second bonding pads on each of the dies to respective circuits fabricated on the dies through respective transistors. The transistors connected to the first bonding pads of an upper die are made conductive while the transistors connected to the second bonding pads of the upper die are made non-conductive. The transistors connected to the second bonding pads of a lower die are made conductive while the transistors connected to the first bonding pads of the lower die are made non-conductive. The second bonding pads of the upper die are connected to the second bonding pads of the lower die through wafer interconnects extending through the upper die. Signals are routed to and from the circuits on the first and second dies through the first and second bonding pads, respectively.

Abstract: A vehicle is shown such as a snowmobile, where a frame includes a tunnel and a front frame portion comprised of cast halves. A suspension system is comprised of upper and lower control arms connected to the front frame portion. Some of the frame components are adhesively fixed together. A powertrain is supported by the frame, and is comprised of an engine and a clutch. The clutch includes a clutch guard supporting an oil container. The engine has an exhaust system which extends through the front frame portion. The snowmobile also has a rear snow deflector.

Abstract: Signals are routed to and from identical stacked integrated circuit dies by selectively coupling first and second bonding pads on each of the dies to respective circuits fabricated on the dies through respective transistors. The transistors connected to the first bonding pads of an upper die are made conductive while the transistors connected to the second bonding pads of the upper die are made non-conductive. The transistors connected to the second bonding pads of a lower die are made conductive while the transistors connected to the first bonding pads of the lower die are made non-conductive. The second bonding pads of the upper die are connected to the second bonding pads of the lower die through wafer interconnects extending through the upper die. Signals are routed to and from the circuits on the first and second dies through the first and second bonding pads, respectively.

Abstract: A snowmobile having an adjustable width front suspension. The snowmobile has a chassis and front skis spaced laterally from each other. For at least one of the skis, a mounting column extends generally upward and parallel radius rods, which may be of adjustable length, are pivotally connected between the chassis and the mounting column. The lateral spacing of the front skis may be adjusted by adjusting the length of the radius rods or by adjusting the lateral position on which the radius rods mount to the chassis or the mounting column.