Patents by Inventor Jake Le

Jake Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250143715
    Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.
    Type: Application
    Filed: September 24, 2024
    Publication date: May 8, 2025
    Applicant: MicroVention, Inc.
    Inventors: Heath Bowman, Jake Le, Matthew Fitz
  • Publication number: 20250127976
    Abstract: The present invention features a filter canister device for filtering clot material from whole blood. The device includes an upper filter chamber and a lower filter chamber coupled to the upper filter chamber. The device further includes a coarse filter mesh disposed within the upper filter chamber, configured to capture the clot material from whole blood directed into the upper filter chamber, and a fine filter mesh disposed within the lower filter chamber, configured to filter the whole blood into filtered whole blood. The device further includes an inlet port fluidly coupled to the upper filter chamber, configured to accept the whole blood into the upper filter chamber. The device further includes an outlet port fluidly coupled to the lower filter chamber, configured to accept the filtered whole blood from the lower filter chamber and direct it to an external source.
    Type: Application
    Filed: October 21, 2024
    Publication date: April 24, 2025
    Inventors: Greg Bak-Boychuk, Jake Le, Sanjay Shrivastava, Cheng Ian
  • Publication number: 20240423632
    Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
    Type: Application
    Filed: June 26, 2024
    Publication date: December 26, 2024
    Applicant: MicroVention, Inc.
    Inventors: Jake Le, Heath Bowman
  • Patent number: 12114864
    Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: October 15, 2024
    Assignee: MicroVention, Inc.
    Inventors: Heath Bowman, Jake Le, Matthew Fitz
  • Patent number: 12048438
    Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: July 30, 2024
    Assignee: MicroVention, Inc.
    Inventors: Jake Le, Heath Bowman
  • Publication number: 20230397914
    Abstract: According to an aspect, an implant for vascular treatment may include a wire having a first section and a second section, the first section and the second section each movable from a delivery state to a deployed state in response to removal of external pressure on the wire, the first section, in the deployed state, including at least one loop securable to a target anatomical location of a subject, the second section, in the deployed state, having a nonlinear shape positionable to at least partially occupy an anatomical vessel with the first section secured to the target anatomical location, and the first section stiffer than the second section.
    Type: Application
    Filed: June 12, 2023
    Publication date: December 14, 2023
    Inventors: Stephanie GONG, Jake LE
  • Publication number: 20230277189
    Abstract: According to some embodiments, a vascular embolic implant (e.g., a vaso-occlusive implant or device) comprises a coil configured to assume a radially-contracted shape for delivery into a subject and configured to assume an implanted or non-elongated shape when positioned into a targeted vascular defect of the subject, wherein the coil is configured to form six sides when in the implanted or non-elongated (e.g. expanded or three-dimensional) shape, wherein at least one side formed by the implanted or non-elongated (e.g. expanded, three-dimensional or non-linear) coil comprises a large loop, and wherein at least one side formed by the implanted or non-elongated (e.g., radially-expanded) coil comprises two or more small loops.
    Type: Application
    Filed: February 16, 2023
    Publication date: September 7, 2023
    Inventor: Jake LE
  • Publication number: 20220273314
    Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
    Type: Application
    Filed: May 17, 2022
    Publication date: September 1, 2022
    Applicant: MicroVention, Inc.
    Inventors: Jake Le, Heath Bowman
  • Publication number: 20220265277
    Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.
    Type: Application
    Filed: May 13, 2022
    Publication date: August 25, 2022
    Applicant: MicroVention, Inc.
    Inventors: Heath Bowman, Jake Le, Matthew Fitz
  • Publication number: 20220202424
    Abstract: Improved thermal detachment driven by leverage from: improved electrical locus targeting allows electron density to define Optimal Regions balancing the resistance and heat whereby, detachment systems are shifted and realigned coaxially and placed closer to the ends of subject coils while being hermetically sealed, manufacturing steps are taught, to show how system is made.
    Type: Application
    Filed: April 2, 2020
    Publication date: June 30, 2022
    Inventors: Jake Le, Dawson Le, Randall Takahashi
  • Patent number: 11357513
    Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: June 14, 2022
    Assignee: MicroVention, Inc.
    Inventors: Heath Bowman, Jake Le, Matthew Fitz
  • Patent number: 11337708
    Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: May 24, 2022
    Assignee: MicroVention, Inc.
    Inventors: Jake Le, Heath Bowman
  • Publication number: 20220142651
    Abstract: Data supported zero displacement implant/coil detachment system is, for example, gamma-irradiated post manufacturing, but made with no tension/zero displacement using more than 1 SR thread.
    Type: Application
    Filed: June 5, 2021
    Publication date: May 12, 2022
    Inventor: Jake Le
  • Publication number: 20210007750
    Abstract: Improved thermal detachment driven by leverage from improved electrical locus targeting enabling first button detachment at optimal regions whereby, for example OPTIMA® brands of coils (BALT USA®, Orange County, CA 92618) and their detachment systems are shifted and realigned coaxially and placed closer to the ends of subject coils while being hermetically sealed,
    Type: Application
    Filed: July 13, 2020
    Publication date: January 14, 2021
    Inventors: Jake Le, Stephanie Gong
  • Publication number: 20200345377
    Abstract: An embolic coil implant system includes double coils which are made easily assimilated into certain aneurysms and delivered with a profile lower than 0.018 mm, an outer diameter of 0.017 mm.
    Type: Application
    Filed: April 29, 2020
    Publication date: November 5, 2020
    Inventors: Jake Le, Alois Zauner
  • Publication number: 20200315630
    Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
    Type: Application
    Filed: June 18, 2020
    Publication date: October 8, 2020
    Applicant: MicroVention, Inc.
    Inventors: Jake Le, Heath Bowman
  • Patent number: 10722242
    Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: July 28, 2020
    Assignee: MicroVention, Inc.
    Inventors: Jake Le, Heath Bowman
  • Publication number: 20200093495
    Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.
    Type: Application
    Filed: November 27, 2019
    Publication date: March 26, 2020
    Applicant: MicroVention, Inc.
    Inventors: Heath Bowman, Jake Le, Matthew Fitz
  • Patent number: 10517604
    Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: December 31, 2019
    Assignee: MicroVention, Inc.
    Inventors: Heath Bowman, Jake Le, Matthew Fitz
  • Publication number: 20190365454
    Abstract: Enhanced thermal pusher assembly ensures: proper delivery of coils profiled for various applications without grounding by thermal attachment and with a handheld controller, in under one second. Attachment controller configures interface with Al, —interface and data transmission and management system.
    Type: Application
    Filed: January 8, 2018
    Publication date: December 5, 2019
    Inventors: Jake Le, David Ferrera, Randall Takahashi, Dawson Le