Patents by Inventor Jake Le
Jake Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250143715Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.Type: ApplicationFiled: September 24, 2024Publication date: May 8, 2025Applicant: MicroVention, Inc.Inventors: Heath Bowman, Jake Le, Matthew Fitz
-
Publication number: 20250127976Abstract: The present invention features a filter canister device for filtering clot material from whole blood. The device includes an upper filter chamber and a lower filter chamber coupled to the upper filter chamber. The device further includes a coarse filter mesh disposed within the upper filter chamber, configured to capture the clot material from whole blood directed into the upper filter chamber, and a fine filter mesh disposed within the lower filter chamber, configured to filter the whole blood into filtered whole blood. The device further includes an inlet port fluidly coupled to the upper filter chamber, configured to accept the whole blood into the upper filter chamber. The device further includes an outlet port fluidly coupled to the lower filter chamber, configured to accept the filtered whole blood from the lower filter chamber and direct it to an external source.Type: ApplicationFiled: October 21, 2024Publication date: April 24, 2025Inventors: Greg Bak-Boychuk, Jake Le, Sanjay Shrivastava, Cheng Ian
-
Publication number: 20240423632Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.Type: ApplicationFiled: June 26, 2024Publication date: December 26, 2024Applicant: MicroVention, Inc.Inventors: Jake Le, Heath Bowman
-
Patent number: 12114864Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.Type: GrantFiled: May 13, 2022Date of Patent: October 15, 2024Assignee: MicroVention, Inc.Inventors: Heath Bowman, Jake Le, Matthew Fitz
-
Patent number: 12048438Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.Type: GrantFiled: May 17, 2022Date of Patent: July 30, 2024Assignee: MicroVention, Inc.Inventors: Jake Le, Heath Bowman
-
Publication number: 20230397914Abstract: According to an aspect, an implant for vascular treatment may include a wire having a first section and a second section, the first section and the second section each movable from a delivery state to a deployed state in response to removal of external pressure on the wire, the first section, in the deployed state, including at least one loop securable to a target anatomical location of a subject, the second section, in the deployed state, having a nonlinear shape positionable to at least partially occupy an anatomical vessel with the first section secured to the target anatomical location, and the first section stiffer than the second section.Type: ApplicationFiled: June 12, 2023Publication date: December 14, 2023Inventors: Stephanie GONG, Jake LE
-
Publication number: 20230277189Abstract: According to some embodiments, a vascular embolic implant (e.g., a vaso-occlusive implant or device) comprises a coil configured to assume a radially-contracted shape for delivery into a subject and configured to assume an implanted or non-elongated shape when positioned into a targeted vascular defect of the subject, wherein the coil is configured to form six sides when in the implanted or non-elongated (e.g. expanded or three-dimensional) shape, wherein at least one side formed by the implanted or non-elongated (e.g. expanded, three-dimensional or non-linear) coil comprises a large loop, and wherein at least one side formed by the implanted or non-elongated (e.g., radially-expanded) coil comprises two or more small loops.Type: ApplicationFiled: February 16, 2023Publication date: September 7, 2023Inventor: Jake LE
-
Publication number: 20220273314Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.Type: ApplicationFiled: May 17, 2022Publication date: September 1, 2022Applicant: MicroVention, Inc.Inventors: Jake Le, Heath Bowman
-
Publication number: 20220265277Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.Type: ApplicationFiled: May 13, 2022Publication date: August 25, 2022Applicant: MicroVention, Inc.Inventors: Heath Bowman, Jake Le, Matthew Fitz
-
Publication number: 20220202424Abstract: Improved thermal detachment driven by leverage from: improved electrical locus targeting allows electron density to define Optimal Regions balancing the resistance and heat whereby, detachment systems are shifted and realigned coaxially and placed closer to the ends of subject coils while being hermetically sealed, manufacturing steps are taught, to show how system is made.Type: ApplicationFiled: April 2, 2020Publication date: June 30, 2022Inventors: Jake Le, Dawson Le, Randall Takahashi
-
Patent number: 11357513Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.Type: GrantFiled: November 27, 2019Date of Patent: June 14, 2022Assignee: MicroVention, Inc.Inventors: Heath Bowman, Jake Le, Matthew Fitz
-
Patent number: 11337708Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.Type: GrantFiled: June 18, 2020Date of Patent: May 24, 2022Assignee: MicroVention, Inc.Inventors: Jake Le, Heath Bowman
-
Publication number: 20220142651Abstract: Data supported zero displacement implant/coil detachment system is, for example, gamma-irradiated post manufacturing, but made with no tension/zero displacement using more than 1 SR thread.Type: ApplicationFiled: June 5, 2021Publication date: May 12, 2022Inventor: Jake Le
-
Publication number: 20210007750Abstract: Improved thermal detachment driven by leverage from improved electrical locus targeting enabling first button detachment at optimal regions whereby, for example OPTIMA® brands of coils (BALT USA®, Orange County, CA 92618) and their detachment systems are shifted and realigned coaxially and placed closer to the ends of subject coils while being hermetically sealed,Type: ApplicationFiled: July 13, 2020Publication date: January 14, 2021Inventors: Jake Le, Stephanie Gong
-
Publication number: 20200345377Abstract: An embolic coil implant system includes double coils which are made easily assimilated into certain aneurysms and delivered with a profile lower than 0.018 mm, an outer diameter of 0.017 mm.Type: ApplicationFiled: April 29, 2020Publication date: November 5, 2020Inventors: Jake Le, Alois Zauner
-
Publication number: 20200315630Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.Type: ApplicationFiled: June 18, 2020Publication date: October 8, 2020Applicant: MicroVention, Inc.Inventors: Jake Le, Heath Bowman
-
Patent number: 10722242Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.Type: GrantFiled: April 10, 2019Date of Patent: July 28, 2020Assignee: MicroVention, Inc.Inventors: Jake Le, Heath Bowman
-
Publication number: 20200093495Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.Type: ApplicationFiled: November 27, 2019Publication date: March 26, 2020Applicant: MicroVention, Inc.Inventors: Heath Bowman, Jake Le, Matthew Fitz
-
Patent number: 10517604Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.Type: GrantFiled: December 21, 2016Date of Patent: December 31, 2019Assignee: MicroVention, Inc.Inventors: Heath Bowman, Jake Le, Matthew Fitz
-
Publication number: 20190365454Abstract: Enhanced thermal pusher assembly ensures: proper delivery of coils profiled for various applications without grounding by thermal attachment and with a handheld controller, in under one second. Attachment controller configures interface with Al, —interface and data transmission and management system.Type: ApplicationFiled: January 8, 2018Publication date: December 5, 2019Inventors: Jake Le, David Ferrera, Randall Takahashi, Dawson Le