Patents by Inventor Jakob Harming

Jakob Harming has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure stamp, device and method for embossing
    Patent number: 10994470
    Abstract: A structure stamp has a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, and an embossing element drive for moving an embossing element along the structure stamp.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: May 4, 2021
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Peter Fischer, Gerald Kreindl, Jakob Harming, Christine Thanner, Christian Schon
  • STRUCTURE STAMP, DEVICE AND METHOD FOR EMBOSSING
    Publication number: 20190351606
    Abstract: A structure stamp has a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, and an embossing element drive for moving an embossing element along the structure stamp.
    Type: Application
    Filed: August 1, 2019
    Publication date: November 21, 2019
    Applicant: EV GROUP E. THALLNER GMBH
    Inventors: Peter FISCHER, Gerald KREINDL, Jakob HARMING, Christine THANNER, Christian SCHON
  • Structure stamp, device and method of embossing
    Patent number: 10414087
    Abstract: A structure stamp has a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, and an embossing element drive for moving an embossing element along the structure stamp.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: September 17, 2019
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Peter Fischer, Gerald Kreindl, Jakob Harming, Christine Thanner, Christian Schon
  • STRUCTURE STAMP, DEVICE AND METHOD OF EMBOSSING
    Publication number: 20180257295
    Abstract: A structure stamp has a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, and an embossing element drive for moving an embossing element along the structure stamp.
    Type: Application
    Filed: May 15, 2018
    Publication date: September 13, 2018
    Applicant: EV GROUP E. THALLNER GMBH
    Inventors: Peter FISCHER, Gerald KREINDL, Jakob HARMING, Christine THANNER, Christian SCHON
  • Structure stamp, device and method of embossing
    Patent number: 10005225
    Abstract: A structure stamp with a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, an embossing element drive for moving an embossing element along the structure stamp.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: June 26, 2018
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Peter Fischer, Gerald Kreindl, Jakob Harming, Christine Thanner, Christian Schön
  • STRUCTURE STAMP, DEVICE AND METHOD OF EMBOSSING
    Publication number: 20150217505
    Abstract: A structure stamp with a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, an embossing element drive for moving an embossing element along the structure stamp.
    Type: Application
    Filed: September 6, 2012
    Publication date: August 6, 2015
    Applicant: EV GROUP E. THALLNER GMBH
    Inventors: Peter Fischer, Gerald Kreindl, Jakob Harming, Christine Thanner, Christian Schön