Patents by Inventor Jakob Helander

Jakob Helander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984661
    Abstract: An electronic device may include first and second phased antenna arrays and a triplet of first, second, and third ultra-wideband antennas. An antenna module in the device may include a dielectric substrate. The first and second arrays and the triplet may be formed on the dielectric substrate. The third and second ultra-wideband antennas may be separated by a gap. The first array may be laterally interposed between the third and second ultra-wideband antennas within the gap. The third ultra-wideband antenna may be laterally interposed between the first phased antenna array and at least some of the second array. An integrated circuit may be mounted to the dielectric substrate using an interposer. The antenna module may occupy a minimal amount of space within the device and may be less expensive to manufacture relative to scenarios where the arrays and the ultra-wideband antennas are formed on separate substrates.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: May 14, 2024
    Assignee: Apple Inc.
    Inventors: Yi Jiang, Jiangfeng Wu, Siwen Yong, Hao Xu, Ana Papio Toda, Carlo di Nallo, Michael D. Quinones, Mattia Pascolini, Amin Tayebi, Aaron J. Cooper, Per Jakob Helander, Johan Avendal
  • Publication number: 20220094053
    Abstract: An electronic device may include first and second phased antenna arrays and a triplet of first, second, and third ultra-wideband antennas. An antenna module in the device may include a dielectric substrate. The first and second arrays and the triplet may be formed on the dielectric substrate. The third and second ultra-wideband antennas may be separated by a gap. The first array may be laterally interposed between the third and second ultra-wideband antennas within the gap. The third ultra-wideband antenna may be laterally interposed between the first phased antenna array and at least some of the second array. An integrated circuit may be mounted to the dielectric substrate using an interposer. The antenna module may occupy a minimal amount of space within the device and may be less expensive to manufacture relative to scenarios where the arrays and the ultra-wideband antennas are formed on separate substrates.
    Type: Application
    Filed: September 21, 2020
    Publication date: March 24, 2022
    Inventors: Yi Jiang, Jiangfeng Wu, Siwen Yong, Hao Xu, Ana Papio Toda, Carlo di Nallo, Michael D. Quinones, Mattia Pascolini, Amin Tayebi, Aaron J. Cooper, Per Jakob Helander, Johan Avendal
  • Patent number: 10103440
    Abstract: A wireless electronic device includes a ground plane including a plurality of slots located along an edge of the ground plane. A dielectric layer is on the ground plane. A stripline on the dielectric layer is opposite the ground plane, positioned to overlap one of the plurality of slots. The stripline is further positioned to not overlap slots adjacent the one of the plurality of slots that the stripline overlaps. The wireless electronic device is configured to resonate at a resonant frequency when excited by a signal transmitted and/or received though the stripline.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: October 16, 2018
    Assignee: Sony Mobile Communications Inc.
    Inventors: Jakob Helander, Zhinong Ying
  • Patent number: 9496623
    Abstract: A wireless electronic device includes a printed circuit board (PCB) with first, second, and third conductive layers separated from one another by dielectric layers. A stripline is included in the first conductive layer. Two highband dipole antenna strips are included in the second conductive layer and/or two lowband dipole antenna strips are included in the third conductive layer. The wireless electronic device may be configured to resonate at a lowband resonant frequency corresponding to the two lowband dipole antenna strips and resonate at a highband resonant frequency corresponding to the two highband dipole antenna strips when excited by a signal transmitted and/or received though the stripline.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: November 15, 2016
    Assignees: Sony Corporation, Sony Mobile Communications Inc.
    Inventors: Jakob Helander, Zhinong Ying
  • Publication number: 20160149314
    Abstract: A wireless electronic device includes a printed circuit board (PCB) with first, second, and third conductive layers separated from one another by dielectric layers. A stripline is included in the first conductive layer. Two highband dipole antenna strips are included in the second conductive layer and/or two lowband dipole antenna strips are included in the third conductive layer. The wireless electronic device may be configured to resonate at a lowband resonant frequency corresponding to the two lowband dipole antenna strips and resonate at a highband resonant frequency corresponding to the two highband dipole antenna strips when excited by a signal transmitted and/or received though the stripline.
    Type: Application
    Filed: November 21, 2014
    Publication date: May 26, 2016
    Inventors: Jakob Helander, Zhinong Ying
  • Publication number: 20160134021
    Abstract: A wireless electronic device includes a ground plane including a plurality of slots located along an edge of the ground plane. A dielectric layer is on the ground plane. A stripline on the dielectric layer is opposite the ground plane, positioned to overlap one of the plurality of slots. The stripline is further positioned to not overlap slots adjacent the one of the plurality of slots that the stripline overlaps. The wireless electronic device is configured to resonate at a resonant frequency when excited by a signal transmitted and/or received though the stripline.
    Type: Application
    Filed: November 6, 2014
    Publication date: May 12, 2016
    Inventors: Jakob Helander, Zhinong Ying