Patents by Inventor Jakob Jütz

Jakob Jütz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6871788
    Abstract: A coin (1) with a metal surface (2, 3) has macroscopic reliefs (5) which serve for visually specifying the value of the coin and as an authenticity feature. Microscopically fine relief structures (8) with a diffraction effect are formed directly in at least one of the surfaces (2, 3). The relief structures (8) are preferably arranged in a recessed relationship and are covered with a lacquer (9). It is also advantageous if at least a part of the relief structures (8) entails an asymmetrical profile shape and/or the grating vectors in a radial orientation. The release structures (8) may also include a machine-readable coding which is recognized by inexpensive optical reading devices for installation in coin testers. The application of the microscopic relief structure (8) to a hard material surface (2, 3) can be effected by the removal of material by means of exposure of the material surface (2, 3) with a laser beam.
    Type: Grant
    Filed: January 18, 2001
    Date of Patent: March 29, 2005
    Assignee: OVD Kinegram AG
    Inventors: Wayne Robert Tompkin, René Staub, Andreas Hasler, Jakob Jütz, Martin Müller
  • Patent number: 6501885
    Abstract: The optical waveguide coupler comprises a structure (1) of a number of elongated narrow optical waveguide strips (2), which consist respectively of a front area (3), a center area (4) and a coupling area (5). The center area (4) has respective transition areas (6) and (7) to the corresponding area (3) or (5). A gap (9) in the front areas (3) provided between two adjoining strips (2) is larger than the thickness of the narrow strips (2). The front faces (8) of the front areas (3), and the front faces of the coupling areas (5) are embodied to be as smooth as possible, wherein all strips form a stack in the coupling area (5). The gaps are pits which result from etching of an Si substrate with the aid of a DRIE etching process.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: December 31, 2002
    Assignee: Contraves Space AG
    Inventors: Reto Holzner, Thomas Brunschwiler, Josef Wagner, Alex Dommann, Andreas Mündle, Jakob Jütz