Abstract: A shelving display system including a first shelf with left and right end portions is disclosed. The left and right end portions engage with left and right endcaps, each including a support structure for the left and right end portions of the shelf. The support structures may include slot recesses, each including a first and second slanted portion one of which engages an end portion of the shelf. The endcaps may include complementary protrusions and grooves configured for slideable engagement with one another such that the endcaps form a stacked configuration. The protrusions may include first and second tongues constructed and dimensioned such that during an assembly step when the protrusions are advanced through the complementary grooves, the first and second tongues deflect from a resting configuration to an assembled configuration. The endcaps may include an interlocking mechanism. The endcaps may have an alignment system including rails and depressions.

Abstract: A shelving display system including a first shelf with left and right end portions is disclosed. The left and right end portions engage with left and right endcaps, each including a support structure for the left and right end portions of the shelf. The support structures may include slot recesses, each including a first and second slanted portion one of which engages an end portion of the shelf. The endcaps may include complementary protrusions and grooves configured for slideable engagement with one another such that the endcaps form a stacked configuration. The protrusions may include first and second tongues constructed and dimensioned such that during an assembly step when the protrusions are advanced through the complementary grooves, the first and second tongues deflect from a resting configuration to an assembled configuration. The endcaps may include an interlocking mechanism. The endcaps may have an alignment system including rails and depressions.

Abstract: The cooling module includes a heat sink for cooling a power component of an ultrasonic source and a resonance tube arranged between the ultrasonic source and the heat sink. The cooling module is designed to guide a stream of air flowing through the resonance tube in a circumferential predefined direction (e.g., in a direction along an inner circumference of the resonance tube). The electronic device includes a power component and a heat sink provided for cooling, the heat sink of the cooling module being designed and arranged for cooling the power component.

Abstract: A cooling device for cooling an electronic component, such as a power semiconductor, includes a cooling body which can be thermally coupled to the component, at least one sonotrode element for generating ultrasonic waves having a predetermined wavelength directed towards the cooling body, and a resonance tube that is associated with the sonotrode element and that is arranged between the sonotrode element and the cooling body, wherein a distance between the sonotrode element and the cooling body corresponds to an integral multiple of a quarter of a wavelength, such that a standing wave is formed between the at least one sonotrode element and the cooling body.