Abstract: A printing system for printing substrates, in particular circuit boards, such as wafer and solar cells, has a printing device, with a printing table on which the substrate can be positioned and a print head associated with the printing table for printing the substrates positioned on the printing table, has a feed device for feeding the substrates to be printed to the printing device, a discharge device for discharging the printed substrates from the printing device, and a plurality of substrate supports on which each of the plurality of substrates can be supported. The feed device, printing device and discharge device convey the substrate supports with the substrates located thereon. The feed device collects plurality of substrate supports and feeds them to the printing device. The printing device prints the substrates on the collected substrate supports, and the discharge device separates and discharges these collected substrate supports.

Abstract: The application relates to a printing machine for printing on planar substrates, in particular circuit boards, including: a printing table which extends in a horizontal plane and on which at least one substrate to be printed on can be arranged; at least one printing device assigned to the printing table, which printing device has a screen holder for an interchangeable printing screen and a doctor device assigned to the screen holder, wherein, by means of the doctor device, a printing material can be applied onto the substrate to be printed on through the printing screen; and a screen magazine assigned to the doctor device for storing at least one printing screen for the doctor device.

Abstract: A printing system for printing substrates, in particular circuit boards, such as wafer and solar cells, has a printing device, with a printing table on which the substrate can be positioned and a print head associated with the printing table for printing the substrates positioned on the printing table, has a feed device for feeding the substrates to be printed to the printing device, a discharge device for discharging the printed substrates from the printing device, and a plurality of substrate supports on which each of the plurality of substrates can be supported. The feed device, printing device and discharge device convey the substrate supports with the substrates located thereon. The feed device collects plurality of substrate supports and feeds them to the printing device. The printing device prints the substrates on the collected substrate supports, and the discharge device separates and discharges these collected substrate supports.

Abstract: A process machine and a related method for treating and/or inspecting printed circuit boards, solar cells or the like, has at least one transport device for transporting the substrates and at least one process device for processing the substrates. The transport device and process device are both separate, self-supporting, modular units. The modular units can be selectively combined with one another in such a way that the transport device undertakes the transportation of the substrates through the process device.

Abstract: The invention relates to a device (1) for applying media to flat substrates (2), especially printed circuit boards, said device comprising a printing device for applying media to the substrate (2) during a printing method, an optical monitoring device for checking the arrangement and/or alignment of the substrate (2) in relation to the printing device, and a dispenser (10) for the additional application of media to the substrate (2). According to the invention, the dispenser (10) is fixed in relation to the optical monitoring device.

Abstract: A device and method for cleaning the edges of substrates, including at least one cleaning head for receiving at least one nozzle element for supplying medium to a substrate. Formed in a main body of the cleaning head are a medium-suctioning port and an adjoining medium-suctioning duct. The cleaning head also has at least one first flange extending from the main body and having a flat side facing the port and extending essentially perpendicular to a surface of the main body containing the port. The nozzle element is provided on the flange and spaced from the main body, and has at least one outlet port opening in the direction that the flat side faces and directed substantially perpendicular thereto. The outlet port is recessed relative to the flat side or is flush therewith. During a cleaning process, the fat side is spaced by 0.05 to 0.5 mm from the substrate surface.

Abstract: To increase the temperature homogeneity on the surface of a substrate that is to be thermally treated, a method for thermally treating substrates is provided, according to which the substrate is heated by several separately controllable heating elements. A desired-value profile is predefined for each of said heating elements. The method comprises the following steps: locally-analysed measurement of the temperature of the surface of the substrate that faces away from the heating elements, during the thermal treatment; determination of the temperature inhomogeneities occurring on the substrate surface; definition of new desired-value profiles based on said temperature inhomogeneities; and preparation of the new desired-value profiles for subsequent treatments.

Abstract: To achieve a uniform coating of a substrate, with an apparatus and a method for coating substrates, according to which the substrate is supported on a substrate holder in such a way that a substrate surface that is to be coated is exposed, and the substrate is rotated together with the substrate holder, a cover can be secured to the substrate holder and together with the substrate holder forms a sealed chamber for the substrate.

Abstract: To increase the temperature homogeneity on the surface of a substrate that is to be thermally treated, a method for thermally treating substrates is provided, according to which the substrate is heated by several separately controllable heating elements. A desired-value profile is predefined for each of said heating elements. The method comprises the following steps: locally-analysed measurement of the temperature of the surface of the substrate that faces away from the heating elements, during the thermal treatment; determination of the temperature inhomogeneities occurring on the substrate surface; definition of new desired-value profiles based on said temperature inhomogeneities; and preparation of the new desired-value profiles for subsequent treatments.

Abstract: A device and method for thermally treating substrates. A substrate is heated by a heating plate to improve thermal homogeneity. The heating plate is heated using a number of separately controlled heating elements. The temperature of the heating elements is measured and the heating process is controlled by a PID controller. In addition, the temperature of the substrate surface facing away from the heating plate is locally measured. The temperature distribution over the substrate surface is determined according to the measured temperatures and set values for the temperature of the individual heating elements are determined and transmitted to the PID controller.

Abstract: A device for coating a plate has an open channel being open in an upward direction and a device for supplying a liquid to the open channel. The liquid in the open channel forms an convexly curved portion projecting upwardly from the open channel. A device for transporting a plate at a close distance past the open channel is provided, with which a surface to be coated of the plate facing the convexly curved portion of the liquid is guided such that a thin film of the liquid is deposited on the surface to be coated by adhesion effects. Another device for lacquering or coating plates or disks has a capillary slot that is filled with a liquid coating medium. The plate to be coated is advanced across the capillary slot with the surface to be coated facing downwardly so that due to the capillary effect a thin layer is deposited on the surface of the plate.