Abstract: A matrix-array detecting device including a stack comprising a matrix array of detecting-element pixels, and an active matrix array comprising a network of rows and columns for controlling the pixels and produced on the surface of a substrate, wherein the detecting-element pixels comprise: a common top electrode; a detecting layer; and discrete bottom electrodes; the device comprising a metallic mesh that is connected to the top electrode; that includes pads comprising at least one metal portion, the pads being incorporated into the detecting layer; and that is positioned in correspondence with the network of controlling rows and columns. A process for fabricating the matrix-array detecting device is also provided.

Abstract: The invention relates to an interface device including an array of pixels and an insulating, transparent substrate, the pixels being connected to the substrate by linking elements, the contact surface between the linking elements and the pixels being strictly smaller than the surface of the pixels facing the substrate.

Abstract: A matrix-array detecting device including a stack comprising a matrix array of detecting-element pixels, and an active matrix array comprising a network of rows and columns for controlling the pixels and produced on the surface of a substrate, wherein the detecting-element pixels comprise: a common top electrode; a detecting layer; and discrete bottom electrodes; the device comprising a metallic mesh that is connected to the top electrode; that includes pads comprising at least one metal portion, the pads being incorporated into the detecting layer; and that is positioned in correspondence with the network of controlling rows and columns. A process for fabricating the matrix-array detecting device is also provided.

Abstract: The invention relates to a process for manufacturing a self-assembled injection monolayer (SAM) on the surface of a metal supporting member, the SAM comprising molecules with a thiol end group. The manufacturing process of the invention comprises the following steps: a) depositing the SAM of desired molecules on a zone in relief of a buffer; and b) transferring the SAM onto the surface of the supporting member by hot pressing of the zone in relief of the buffer obtained in step a). The invention is applicable in particular to the field of electronics.

Abstract: An organic photodetector comprising a first electrode (11 to 31) that is plane and formed on a substrate (10 to 30) that is plane, a convex active layer (12 to 32) formed on the first electrode, and a second electrode (13 to 33) formed on the active layer, means for concentrating light radiation in the active layer being incorporated in the photodetector.

Abstract: A method of manufacturing a microelectronic device including a first component hybridized with a second component via electric interconnects, involves the steps of: (i) forming the first and second components, the second component being transparent to ultraviolet radiation at least in line with locations provided for the interconnects; (ii) forming interconnection elements including copper oxide on the second component at the locations provided for the interconnects; (iii) placing the first and second components on each other; and (iv) applying the ultraviolet radiation through the second component on the elements including copper oxide to implement an ultraviolet anneal converting copper oxide into copper.

Abstract: An organic photodetector comprising a first electrode (11 to 31) that is plane and formed on a substrate (10 to 30) that is plane, a convex active layer (12 to 32) formed on the first electrode, and a second electrode (13 to 33) formed on the active layer, means for concentrating light radiation in the active layer being incorporated in the photodetector.

Abstract: A method of manufacturing a microelectronic device including a first component hybridized with a second component via electric interconnects, involves the steps of: (i) forming the first and second components, the second component being transparent to ultraviolet radiation at least in line with locations provided for the interconnects; (ii) forming interconnection elements including copper oxide on the second component at the locations provided for the interconnects; (iii) placing the first and second components on each other; and (iv) applying the ultraviolet radiation through the second component on the elements including copper oxide to implement an ultraviolet anneal converting copper oxide into copper.

Abstract: The invention relates to an interface device including an array of pixels and an insulating, transparent substrate, the pixels being connected to the substrate by linking elements, the contact surface between the linking elements and the pixels being strictly smaller than the surface of the pixels facing the substrate.

Abstract: The invention relates to a process for manufacturing a self-assembled injection monolayer (SAM) on the surface of a metal supporting member, the SAM comprising molecules with a thiol end group. The manufacturing process of the invention comprises the following steps: a) depositing the SAM of desired molecules on a zone in relief of a buffer; and b) transferring the SAM onto the surface of the supporting member by hot pressing of the zone in relief of the buffer obtained in step a). The invention is applicable in particular to the field of electronics.