Abstract: An enhanced anaerobic adhesive composition containing microencapsulated metal ions is disclosed. Microencapsulated metal ions, such as iron oxide, copper naphthenate, cobalt naphthenate, ferrocene, and ferrocene derivatives, act as bonding sites in the composition, such that the composition achieves more complete polymerizations in a shorter curing time. The curing properties and the cure quality are significantly improved by the inclusion of microencapsulated metal ions. The composition can be used to bond metal and plastic substrates.

Abstract: A high temperature polyamide coating and a fastener coated with a composition that includes from about 60 wt. % to about 80 wt. % of an aliphatic polyamide having a repeating unit. The composition also includes from about 3 wt. % to about 9 wt. % of an epoxy based resin having a molecular weight in the range from about 525 to about 585, from about 4 wt. % to about 10 wt. % of a ceramic microsphere material and from about 2 wt. % to about 5 wt. % of a thermoplastic methacrylate binder, from about 4 wt. % to about 12 wt. % of crushed glass, from about 0.1 wt. % to about 1 wt. % of a polyamide with a secondary amino group as a curing agent, and the balance of an epoxy based curing agent.

Abstract: An enhanced anaerobic adhesive composition containing microencapsulated metal ions is disclosed. Microencapsulated metal ions, such as iron oxide, copper naphthenate, cobalt naphthenate, ferrocene, and ferrocene derivatives, act as bonding sites in the composition, such that the composition achieves more complete polymerization in a shorter curing time. The curing properties and the cure quality are significantly improved by the inclusion of microencapsulated metal ions. The composition can be used to bond metal and plastic substrates.