Abstract: Multiple, single conductor, tape automated bonding (TAB) tapes are sequentially applied to a semiconductor device by the bonding of a first, etched, single layer TAB tape to an outer row of bonding pads on a semiconductor chip and to selected contacts on a lead frame followed by the laying down of at least one additional etched, single layer TAB tape which is then bonded to an inner row of bonding pads on the semiconductor chip and to different selected lead frame contacts. If desired the subsequent TAB tape may be adhered to the preceding TAB tape to increase the mechanical strength of all the tapes and improve the electrical characteristics of the tapes. The application of one or more ground planes to the assembly is also shown.