Patents by Inventor James A. Blanton

James A. Blanton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical connector having energy-formed solder stops and methods of making and using the same
    Patent number: 5334422
    Abstract: A method of forming solder stops on a thick film, comprising a conductive metal and an inorganic oxide, including the step of directing a laser beam onto the film to form a surface consisting essentially of fused inorganic oxides which acts as a solder stop.
    Type: Grant
    Filed: February 5, 1993
    Date of Patent: August 2, 1994
    Assignee: Delco Electronics Corp.
    Inventors: Bruce A. Myers, John K. Isenberg, Christine R. Coapman, James A. Blanton
  • Electrical connector having energy-formed solder stops and methods of making and using the same
    Patent number: 5281772
    Abstract: A method of forming solder stops on a thick film, comprising a conductive metal and an inorganic oxide, including the step of directing a laser beam onto the film to form a surface consisting essentially of fused inorganic oxides which acts as a solder stop.
    Type: Grant
    Filed: October 28, 1991
    Date of Patent: January 25, 1994
    Assignee: Delco Electronics Corporation
    Inventors: Bruce A. Myers, John K. Isenberg, Christine R. Coapman, James A. Blanton
  • Provision of substrate pillars to maintain chip standoff
    Patent number: 5220200
    Abstract: Pillars are formed on a substrate at the same time as electrical circuit components are formed thereon and of the same materials used to form the circuit, the pillars serving to maintain standoff of an integrated circuit chip during bonding of solder bumps on the chip underside to the formed substrate circuit. The pillars are provided without extra materials and steps, under the existing alignment requirements for providing the circuit components, during the applying of a series of discontinuous layers, e.g., by screen printing, onto the substrate to form the circuit, by also applying portions of the series of layers as stacked layers in spaced island areas to form the pillars at otherwise unused substrate sites.
    Type: Grant
    Filed: July 23, 1991
    Date of Patent: June 15, 1993
    Assignee: Delco Electronics Corporation
    Inventor: James A. Blanton
  • Method of providing standoff pillars
    Patent number: 5056215
    Abstract: Pillars are formed on a substrate at the same time as electrical circuit components are formed thereon and of the same materials used to form the circuit, the pillars serving to maintain standoff of an integrated circuit chip during bonding of solder bumps on the chip underside to the formed substrate circuit. The pillars are provided without extra materials and steps, under the existing alignment requirements for providing the circuit components, during the applying of a series of discontinuous layers, e.g., by screen printing, onto the substrate to form the circuit, by also applying portions of the series of layers as stacked layers in spaced island areas to form the pillars at otherwise unused substrate sites.
    Type: Grant
    Filed: December 10, 1990
    Date of Patent: October 15, 1991
    Assignee: Delco Electronics Corporation
    Inventor: James A. Blanton