Patents by Inventor James A. Boardman

James A. Boardman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Differential planarization
    Patent number: 7105925
    Abstract: Method and structure for optimizing and controlling chemical mechanical planarization are disclosed. Embodiments of the invention include planarization techniques to make nonplanar surfaces comprising alternating metal and intermetal layers. Relative protrusion dimensions and uniformity of various layers may be accurately controlled using the disclosed techniques.
    Type: Grant
    Filed: February 2, 2005
    Date of Patent: September 12, 2006
    Assignee: Intel Corporation
    Inventors: James A. Boardman, Sarah E. Kim, Paul B. Fischer, Mauro J. Kobrinsky
  • Differential planarization
    Patent number: 6914002
    Abstract: Method and structure for optimizing and controlling chemical mechanical planarization are disclosed. Embodiments of the invention include planarization techniques to make nonplanar surfaces comprising alternating metal and intermetal layers. Relative protrusion dimensions and uniformity of various layers may be accurately controlled using the disclosed techniques.
    Type: Grant
    Filed: December 28, 2002
    Date of Patent: July 5, 2005
    Assignee: Intel Corporation
    Inventors: James A. Boardman, Sarah E. Kim, Paul B. Fischer, Mauro J. Kobrinsky
  • Differential planarization
    Publication number: 20040127049
    Abstract: Method and structure for optimizing and controlling chemical mechanical planarization are disclosed. Embodiments of the invention include planarization techniques to make nonplanar surfaces comprising alternating metal and intermetal layers. Relative protrusion dimensions and uniformity of various layers may be accurately controlled using the disclosed techniques.
    Type: Application
    Filed: December 28, 2002
    Publication date: July 1, 2004
    Inventors: James A. Boardman, Sarah E. Kim, Paul B. Fischer, Mauro J. Kobrinsky
  • Method of forming a raised contact for a substrate
    Patent number: 6596640
    Abstract: The present invention includes a method of providing a first substrate; forming an insulator over the first substrate; forming an opening in the insulator; forming a conductor over the insulator and in the opening; removing the conductor over the insulator with a first chemical-mechanical polish process to leave the conductor in the opening; and reducing thickness of the insulator with a second chemical-mechanical process to permit the conductor in the opening to protrude. The present invention further includes a structure having such a conductor that protrudes.
    Type: Grant
    Filed: June 21, 2002
    Date of Patent: July 22, 2003
    Assignee: Intel Corporation
    Inventors: Paul B. Fishcer, James A. Boardman, Anne E. Miller