Abstract: Tamper-detect assemblies and methods of fabrication are provided. A tamper-detect assembly includes a laminate carrier with embedded tamper-detect circuitry within the laminate carrier, and one or more electronic components on the laminate carrier. Further, the tamper-detect assembly includes a heat sink cover. The heat sink cover includes a heat sink and tamper-detect circuitry integrated within the heat sink cover. The heat sink cover is mounted to the laminate carrier and encloses the one or more electronic components between the laminate carrier and the heat sink cover. Together, the embedded tamper-detect circuitry of the laminate carrier and the integrated tamper-detect circuitry of the heat sink cover define, at least in part, a secure volume about the one or more electronic components.

Abstract: Tamper-respondent assemblies are provided which include individualized fluid chemical mixtures for tamper detection. The tamper-respondent assemblies include, for instance, a circuit board and an enclosure. The circuit board includes an electronic component, and the enclosure is mounted to the circuit board to enclose the electronic component within a secure volume, where the secure volume is a sealed space. A fluid is disposed within the secure volume that includes a chemical mixture of multiple chemical substances, and the multiple chemical substances have randomly generated concentrations within the chemical mixture. One or more sensors are provided to facilitate detecting a change in the chemical mixture of the fluid within the secure volume indicative of a tamper event.

Abstract: In-situ fabrication of tamper-respondent sensors with random security circuit patterns is provided. The method includes establishing a random security circuit pattern for fabricating a security circuit of a tamper-respondent sensor to enclose, at least in part, one or more components within a secure volume. The establishing includes generating a trace pattern extending once through nodes of a plurality of nodes dispersed within an area of the tamper-respondent sensor, and randomly modifying the trace pattern to produce a randomly modified trace pattern with a desired randomization index relative to a specified randomization threshold, and providing the randomly modified trace pattern as a random security circuit pattern. Further, the method includes initiating fabricating of the tamper-respondent sensor in-situ on a surface of an enclosure to facilitate defining the secure volume, with the fabricating using the random security circuit pattern.

Abstract: An electronic component includes a first trace configured to transmit a first signal and a second trace configured to transmit a second signal. The electronic component further includes a layer of conductive material separated from the first and second traces by a layer of insulative material. The electronic component further includes a first vertical wall formed in direct contact with the layer of conductive material. The electronic component further includes a second vertical wall formed in direct contact with the layer of conductive material. The second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.

Abstract: Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.

Abstract: Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.

Abstract: A structure of a circuitry substrate for securing an area from tampering is disclosed. The structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.

Abstract: An electronic component includes a first trace configured to transmit a first signal and a second trace configured to transmit a second signal. The electronic component further includes a layer of conductive material separated from the first and second traces by a layer of insulative material. The electronic component further includes a first vertical wall formed in direct contact with the layer of conductive material. The electronic component further includes a second vertical wall formed in direct contact with the layer of conductive material. The second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.

Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.

Abstract: A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.

Abstract: Tamper-respondent assemblies are provided which include an enclosure mounted to a circuit board and enclosing one or more components to be protected within a secure volume. A tamper-respondent sensor covers, at least in part, an inner surface of the enclosure, and includes at least one tamper-detect circuit. A monitor circuit is disposed within the secure volume to monitor the tamper-detect circuit(s) for a tamper event. A pressure connector assembly is also disposed within the secure volume, between the tamper-respondent sensor and the circuit board. The pressure connector assembly includes a conductive pressure connector electrically connecting, at least in part, the monitor circuit and the tamper-detect circuit(s) of the tamper-respondent assembly, and a spring-biasing mechanism to facilitate breaking electrical connection of the conductive pressure connector to the tamper-detect circuit(s) with a tamper event.

Abstract: Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.

Abstract: An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.

Abstract: An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

Abstract: Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.

Abstract: Tamper-respondent assemblies are provided which include an enclosure mounted to a circuit board and enclosing one or more components to be protected within a secure volume. A tamper-respondent sensor covers, at least in part, an inner surface of the enclosure, and includes at least one tamper-detect circuit. A monitor circuit is disposed within the secure volume to monitor the tamper-detect circuit(s) for a tamper event. A pressure connector assembly is also disposed within the secure volume, between the tamper-respondent sensor and the circuit board. The pressure connector assembly includes a conductive pressure connector electrically connecting, at least in part, the monitor circuit and the tamper-detect circuit(s) of the tamper-respondent assembly, and a spring-biasing mechanism to facilitate breaking electrical connection of the conductive pressure connector to the tamper-detect circuit(s) with a tamper event.

Abstract: A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.

Abstract: An electronic system can include an electronic module and a trace circuit that provides a perimeter that encloses the electronic module. A sensing circuit within the electronic system can be configured to detect a discontinuity in the perimeter. In response to detecting the discontinuity in the perimeter, the sensing circuit can initiate, from a response device, a response signal.

Abstract: Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.