Abstract: Disclosed are polyol compositions with a low viscosity that exhibit superior heat resistance, enhanced stability in the presence of water, improved strength, hardness, and molding characteristics relative to known polyurethane materials. Disclosed is a polyol composition comprising: (a) at least one monomeric polyol comprising three or more hydroxyl groups; (b) at least one higher polyol comprising three or more hydroxyl groups; and (c) at least one polyhydroxylated aromatic compound; wherein the at least one higher polyol comprises residues of either or both of the at least one monomeric polyol and the polyhydroxylated aromatic compound linked by one or more carbonate groups, oxygen ether groups, or a combination thereof. Disclosed are methods of preparing the disclosed compositions. Disclosed are articles prepared from the disclosed compositions that exhibit flexural strengths in excess of 10,000 psi and flexural moduli in excess of 400,000 psi, and exhibit outstanding green strength.

Abstract: Disclosed is a polyol composition comprising: (a) at least one monomeric polyol comprising three or more hydroxyl groups; (b) at least one higher polyol comprising three or more hydroxyl groups; and (c) at least one polyhydroxylated aromatic compound; wherein the at least one higher polyol comprises residues of either or both of the at least one monomeric polyol and the polyhydroxylated aromatic compound linked by one or more carbonate groups, oxygen ether groups, or a combination thereof, and wherein the polyol composition has a viscosity of less than 5000 cps at 150 degrees Fahrenheit. The at least one monomeric polyol and at least one higher polyol may have any structures affording polyol compositions and polyurethane compositions having the requisite physical characteristics in terms of polyol composition viscosity and polyurethane heat resistance, strength and flexural modulus.

Abstract: Disclosed is a polyol composition comprising: (a) at least one monomeric polyol comprising three or more hydroxyl groups; (b) at least one higher polyol comprising three or more hydroxyl groups; and (c) at least one polyhydroxylated aromatic compound; wherein the at least one higher polyol comprises residues of either or both of the at least one monomeric polyol and the polyhydroxylated aromatic compound linked by one or more carbonate groups, oxygen ether groups, or a combination thereof, and wherein the polyol composition has a viscosity of less than 5000 cps at 150 degrees Fahrenheit. The at least one monomeric polyol and at least one higher polyol may have any structures affording polyol compositions and polyurethane compositions having the requisite physical characteristics in terms of polyol composition viscosity and polyurethane heat resistance, strength and flexural modulus.

Abstract: There is provided an oligomeric polyol composition having (a) an oligomeric network containing residues of at least one polyhydroxylated aromatic compound and residues of at least one polyol having at least three hydroxyl groups; and (b) a plurality of peripheral groups having one or more pendant hydroxyl groups bound to the oligomeric network by a plurality of linking units. The residues of the polyol may optionally contain one or more oxygen ether groups, one or more amino ether groups, or both of one or more oxygen ether groups and one or more amino ether groups. Reaction of the oligomeric polyols with isocyanate monomers affords a new class of polyurethanes having superior heat and water resistance. The new polyurethanes exhibit lower peak exotherms, typically less than 250° F. during in-mold polymerization.

Abstract: There is provided an oligomeric polyol composition having (a) an oligomeric network containing residues of at least one polyhydroxylated aromatic compound and residues of at least one polyol having at least three hydroxyl groups; and (b) a plurality of peripheral groups having one or more pendant hydroxyl groups bound to the oligomeric network by a plurality of linking units. The residues of the polyol may optionally contain one or more oxygen ether groups, one or more amino ether groups, or both of one or more oxygen ether groups and one or more amino ether groups. Reaction of the oligomeric polyols with isocyanate monomers affords a new class of polyurethanes having superior heat and water resistance. The new polyurethanes exhibit lower peak exotherms, typically less than 250° F. during in-mold polymerization.

Abstract: There is provided an oligomeric polyol composition having (a) an oligomeric network containing residues of at least one polyhydroxylated aromatic compound and residues of at least one polyol having at least three hydroxyl groups; and (b) a plurality of peripheral groups having one or more pendant hydroxyl groups bound to the oligomeric network by a plurality of linking units. The residues of the polyol may optionally contain one or more oxygen ether groups, one or more amino ether groups, or both of one or more oxygen ether groups and one or more amino ether groups. Reaction of the oligomeric polyols with isocyanate monomers affords a new class of polyurethanes having superior heat and water resistance. The new polyurethanes exhibit lower peak exotherms, typically less than 250° F. during in-mold polymerization.

Abstract: There is provided an oligomeric polyol composition having (a) an oligomeric network containing residues of at least one polyhydroxylated aromatic compound and residues of at least one polyol having at least three hydroxyl groups; and (b) a plurality of peripheral groups having one or more pendant hydroxyl groups bound to the oligomeric network by a plurality of linking units. The residues of the polyol may optionally contain one or more oxygen ether groups, one or more amino ether groups, or both of one or more oxygen ether groups and one or more amino ether groups. Reaction of the oligomeric polyols with isocyanate monomers affords a new class of polyurethanes having superior heat and water resistance. The new polyurethanes exhibit lower peak exotherms, typically less than 250° F. during in-mold polymerization.

Abstract: There is provided an oligomeric polyol composition having (a) an oligomeric network containing residues of at least one polyhydroxylated aromatic compound and residues of at least one polyol having at least three hydroxyl groups; and (b) a plurality of peripheral groups having one or more pendant hydroxyl groups bound to the oligomeric network by a plurality of linking units. The residues of the polyol may optionally contain one or more oxygen ether groups, one or more amino ether groups, or both of one or more oxygen ether groups and one or more amino ether groups. Reaction of the oligomeric polyols with isocyanate monomers affords a new class of polyurethanes having superior heat and water resistance. The new polyurethanes exhibit lower peak exotherms, typically less than 250° F. during in-mold polymerization.

Abstract: There is provided an oligomeric polyol composition having (a) an oligomeric network containing residues of at least one polyhydroxylated aromatic compound and residues of at least one polyol having at least three hydroxyl groups; and (b) a plurality of peripheral groups having one or more pendant hydroxyl groups bound to the oligomeric network by a plurality of linking units. The residues of the polyol may optionally contain one or more oxygen ether groups, one or more amino ether groups, or both of one or more oxygen ether groups and one or more amino ether groups. Reaction of the oligomeric polyols with isocyanate monomers affords a new class of polyurethanes having superior heat and water resistance. The new polyurethanes exhibit lower peak exotherms, typically less than 250° F. during in-mold polymerization.

Abstract: There is provided an oligomeric polyol composition having (a) an oligomeric network containing residues of at least one polyhydroxylated aromatic compound and residues of at least one polyol having at least three hydroxyl groups; and (b) a plurality of peripheral groups having one or more pendant hydroxyl groups bound to the oligomeric network by a plurality of linking units. The residues of the polyol may optionally contain one or more oxygen ether groups, one or more amino ether groups, or both of one or more oxygen ether groups and one or more amino ether groups. Reaction of the oligomeric polyols with isocyanate monomers affords a new class of polyurethanes having superior heat and water resistance. The new polyurethanes exhibit lower peak exotherms, typically less than 250° F. during in-mold polymerization.

Abstract: There is provided an oligomeric polyol composition having (a) an oligomeric network containing residues of at least one polyhydroxylated aromatic compound and residues of at least one polyol having at least three hydroxyl groups; and (b) a plurality of peripheral groups having one or more pendant hydroxyl groups bound to the oligomeric network by a plurality of linking units. The residues of the polyol may optionally contain one or more oxygen ether groups, one or more amino ether groups, or both of one or more oxygen ether groups and one or more amino ether groups. Reaction of the oligomeric polyols with isocyanate monomers affords a new class of polyurethanes having superior heat and water resistance. The new polyurethanes exhibit lower peak exotherms, typically less than 250° F. during in-mold polymerization.

Abstract: There is provided an oligomeric polyol composition having (a) an oligomeric network containing residues of at least one polyhydroxylated aromatic compound and residues of at least one polyol having at least three hydroxyl groups; and (b) a plurality of peripheral groups having one or more pendant hydroxyl groups bound to the oligomeric network by a plurality of linking units. The residues of the polyol may optionally contain one or more oxygen ether groups, one or more amino ether groups, or both of one or more oxygen ether groups and one or more amino ether groups. Reaction of the oligomeric polyols with isocyanate monomers affords a new class of polyurethanes having superior heat and water resistance. The new polyurethanes exhibit lower peak exotherms, typically less than 250° F. during in-mold polymerization.

Abstract: There is provided an oligomeric polyol composition having (a) an oligomeric network containing residues of at least one polyhydroxylated aromatic compound and residues of at least one polyol having at least three hydroxyl groups; and (b) a plurality of peripheral groups having one or more pendant hydroxyl groups bound to the oligomeric network by a plurality of linking units. The residues of the polyol may optionally contain one or more oxygen ether groups, one or more amino ether groups, or both of one or more oxygen ether groups and one or more amino ether groups. Reaction of the oligomeric polyols with isocyanate monomers affords a new class of polyurethanes having superior heat and water resistance. The new polyurethanes exhibit lower peak exotherms, typically less than 250° F. during in-mold polymerization.

Abstract: There is provided an oligomeric polyol composition having (a) an oligomeric network containing residues of at least one polyhydroxylated aromatic compound and residues of at least one polyol having at least three hydroxyl groups; and (b) a plurality of peripheral groups having one or more pendant hydroxyl groups bound to the oligomeric network by a plurality of linking units. The residues of the polyol may optionally contain one or more oxygen ether groups, one or more amino ether groups, or both one or more oxygen ether groups and one or more amino ether groups. Reaction of the oligomeric polyols with isocyanate monomers affords a new class of polyurethanes having superior heat and water resistance. The new polyurethanes exhibit lower peak exotherms, typically less than 250° F. during in-mold polymerization.

Abstract: The present invention provides an optoelectronic device comprising a light emitting semiconductor and an encapsulant. The encapsulant is made from an encapsulant formulation comprising an epoxy compound and a silicone anhydride such as Formula (D-1) compound. The present invention also provides a method of preparing such optoelectronic device.

Abstract: Polycarbonate having increased end-cap levels is made by adding an end-capping agent to the polycarbonate, preferably after the polycarbonate has reached a number-average molecular weight of about 2,000 to 15,000 Dalton.

Abstract: Polycarbonate having increased end-cap levels is made by adding an end-capping agent to the polycarbonate, preferably after the polycarbonate has reached a number-average molecular weight of about 2,000 to 15,000 Dalton. The end-capping agent has the formula: wherein R1 is a phenyl, phenoxy, benzyl, or benzyloxy and R2 is selected from the group consisting of C1-C30 alkyl, C1-C30 alkoxy, C6-C30 aryl, C6-C30 aryloxy, C7-C30 aralkyl, and C7-C30 aralkyloxy.

Abstract: A method comprising (a) synthesis of a poly(arylene ether) having the structure (1) wherein m is an integer having an average value in the range from about 3 to about 300; (b) solution functionalization of polymer (1) to form functionalized poly(arylene ether) having the structure (2) wherein X is a reactive functional group selected from the group consisting of anhydride, hydroxyl, epoxy, carboxyl, —R1OH, R1CO2R2, —R1CH2═CH2, or vinyl, wherein R1 is a primary or secondary divalent alkyl or haloalky group having from 1 to 20 carbons, or an aryl group and R2 is a primary or secondary alkyl group having from 1 to 10 carbons; and Q4 is hydrogen, X, or a mixture thereof; (c) reaction of functionalized poly(arylene ether) (2) with a poly(organosiloxane) having structure (3): wherein x is zero or one and Y is a functional group reactive with X, selected from the group consisting of —OH, —CH2═CH2, epoxy, amino, carboxy, &mdash

Abstract: A polyimide composition and polyimide composite are provided. The composition has a polyimide resin, a reactive plasticizer and a phosphate. The composition is crosslinked and exhibits desired levels of processability and improved thermooxidative stability. The composites have a polyimide resin, a phosphate and reinforcing fibers, and exhibit reduced wear and friction. The compositions and composites are useful for making aircraft engine hardware such as bushings.

Abstract: Room temperature vulcanizable organopolysiloxane compositions comprising derivatives of silacycloalkanes are described and they unexpectedly display a reduction in viscosity prior to curing, a reduction in modulus after curing and favorable cure rates.