Abstract: A method of fabricating MMCs having high thermal conductivity coupled with coefficient of thermal expansion (CTE) values which approximates the CTE of ceramics and semi-conductor materials typically used in electronic packaging. The method comprises preparing a formed agglomeration of powder particles (preform); partially sintering the preform; placing the partially sintered preform into a forming chamber; infiltrating the preform with liquid-phase metal; and allowing the liquid-phase metal to solidify and form an MMC around and through the preform. In a preferred embodiment, the preform is constructed from silicon carbide, and the metal matrix is an aluminum-silicon alloy.

Abstract: A ceramic material and a method of forming a ceramic material which possesses a high impact resistance. The material comprises: (a) a first continuous phase of .beta.-SiC; and (b) a second phase of about 25-40 vol % TiB.sub.2. Al.sub.2 O.sub.3 is preferably used as a densification aid. The material is formed by hot-pressing the mixture at a temperature from greater than about 1800.degree. C. to less than the transition temperature of .beta.-SiC to .alpha.-SiC. The hot-pressing is performed at a pressure of about 2000 psi to about 4000 psi in an inert atmosphere for several hours and results in the formation of a two phase sintered ceramic composite material.