Patents by Inventor James A. Dirksen

James A. Dirksen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6872328
    Abstract: A method of polishing or planarizing a substrate comprising abrading at least a portion of the surface of a substrate comprising a metal, metal oxide, metal composite, or mixture thereof, with a composition comprising a metal oxide abrasive and a liquid carrier, wherein the composition has a pH of about 7 or less and the metal oxide abrasive has a total surface hydroxyl group density no greater than about 3 hydroxyl groups per nm2.
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: March 29, 2005
    Assignee: Cabot Microelectronics Corporation
    Inventors: James A. Dirksen, David W. Boldridge, Gautam S. Grover
  • Patent number: 6716755
    Abstract: A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises a liquid carrier, a chemical accelerator, and solids comprising about 5-90 wt. % of fumed metal oxide, and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: April 6, 2004
    Assignee: Cabot Microelectronics Corporation
    Inventors: Mingming Fang, Brian L. Mueller, James A. Dirksen
  • Publication number: 20030124852
    Abstract: A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises a liquid carrier, a chemical accelerator, and solids comprising about 5-90 wt. % of fumed metal oxide, and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.
    Type: Application
    Filed: January 10, 2003
    Publication date: July 3, 2003
    Applicant: Cabot Microelectronics Corporation
    Inventors: Mingming Fang, Brian L. Mueller, James A. Dirksen
  • Patent number: 6527817
    Abstract: A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises a liquid carrier, a chemical accelerator, and solids comprising about 5-90 wt. % of fumed metal oxide, and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.
    Type: Grant
    Filed: July 25, 2000
    Date of Patent: March 4, 2003
    Assignee: Cabot Microelectronics Corporation
    Inventors: Mingming Fang, Brian L. Mueller, James A. Dirksen
  • Patent number: 6432319
    Abstract: An absorption heat pump achieves improved efficiency by lowering the low cycle temperature of the circulation fluid. This is accomplished by adding a crystallization-inhibiting compound to the circulation fluid which substantially depresses the temperature at which the absorbent salt in the fluid begins to crystallize.
    Type: Grant
    Filed: October 23, 2000
    Date of Patent: August 13, 2002
    Assignee: University of Utah
    Inventors: Terry A. Ring, James A. Dirksen
  • Publication number: 20020076932
    Abstract: A method of polishing or planarizing a substrate comprising abrading at least a portion of the surface of a substrate comprising a metal, metal oxide, metal composite, or mixture thereof, with a composition comprising a metal oxide abrasive and a liquid carrier, wherein the composition has a pH of about 7 or less and the metal oxide abrasive has a total surface hydroxyl group density no greater than about 3 hydroxyl groups per nm2.
    Type: Application
    Filed: December 15, 2000
    Publication date: June 20, 2002
    Inventors: James A. Dirksen, David W. Boldridge
  • Patent number: 6350393
    Abstract: Chemical mechanical polishing compositions including an abrasive and cesium hydroxide and methods for polishing dielectric layers associated with integrated circuits using cesium hydroxide containing polishing compositions.
    Type: Grant
    Filed: November 4, 1999
    Date of Patent: February 26, 2002
    Assignee: Cabot Microelectronics Corporation
    Inventors: Alicia F. Francis, Brian L. Mueller, James A. Dirksen, Paul M. Feeney
  • Publication number: 20010051433
    Abstract: Chemical mechanical polishing compositions including an abrasive and cesium hydroxide and methods for polishing dielectric layers associated with integrated circuits using cesium hydroxide containing polishing compositions
    Type: Application
    Filed: November 4, 1999
    Publication date: December 13, 2001
    Inventors: Alicia F. Francis, Brian L. Mueller, James A. Dirksen, Paul M. Feeney
  • Patent number: 6319096
    Abstract: A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises about 5-90 wt. % of fumed metal oxide and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.
    Type: Grant
    Filed: November 15, 1999
    Date of Patent: November 20, 2001
    Assignees: Cabot Corporation, Cabot Microelectronics Corporation
    Inventors: Brian L. Mueller, James A. Dirksen
  • Patent number: 6293848
    Abstract: A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises a liquid carrier, a chemical accelerator, and solids comprising about 5-90 wt. % of fumed metal oxide, and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.
    Type: Grant
    Filed: November 15, 1999
    Date of Patent: September 25, 2001
    Assignee: Cabot Microelectronics Corporation
    Inventors: Mingming Fang, Brian L. Mueller, James A. Dirksen
  • Patent number: 6177025
    Abstract: An absorption heat pump achieves improved efficiency by lowering the low cycle temperature of the circulation fluid. This is accomplished by adding a crystallization-inhibiting compound to the circulation fluid which substantially depresses the temperature at which the absorbent salt in the fluid begins to crystallize.
    Type: Grant
    Filed: November 17, 1998
    Date of Patent: January 23, 2001
    Assignee: University of Utah
    Inventors: Terry A. Ring, James A. Dirksen