Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component includes an array of spaced-apart dams, each of which is associated with and circumscribes an open contact volume associated with one of the contacts. A dielectric material may cover the portion of the microelectronic component active surface that is external to the dams and extend between the spaced-apart dams.

Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component includes an array of spaced-apart dams, each of which is associated with and circumscribes an open contact volume associated with one of the contacts. A dielectric material may cover the portion of the microelectronic component active surface that is external to the dams and extend between the spaced-apart dams.

Abstract: The spring-loaded contact probe electrically connects a semiconductor device, such as a device under test (DUT) with a substrate, such as a DUT board to be coupled with testing equipment. The probe comprises a barrel, two probes slidable within the barrel, and two isolated springs for loading the probes. The two isolated springs allow the probes to be engaged without affecting the connection of the opposite probe. The barrel housing the probes is securely attached within a socket. An array of these sockets may be used as a connector device between the DUT and DUT board.