Abstract: A method of continuously recovering hydrocarbons from carbon ores can include providing first and second vessels containing rubblized carbon ore. A cooling fuel gas can be introduced into the first vessel. The cooling fuel gas can include oxygen and a recycle gas from the second vessel, which includes hydrocarbons and oxidation products. The oxygen can be consumed through oxidation in an oxidation zone in the first vessel. The temperature of the oxidation zone can be controlled by limiting the oxygen concentration in the cooling fuel gas. This can produce a hot oxidation product gas that heats rubblized carbon ore in a pyrolysis zone downstream of the oxidation zone. Gaseous and vapor hydrocarbons can be produced in the pyrolysis zone. The vapor hydrocarbons can be condensed in a condensing zone downstream of the pyrolysis zone and then collected. The remaining gaseous hydrocarbons and oxidation products can be recycled as the recycle gas.

Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component includes an array of spaced-apart dams, each of which is associated with and circumscribes an open contact volume associated with one of the contacts. A dielectric material may cover the portion of the microelectronic component active surface that is external to the dams and extend between the spaced-apart dams.

Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component includes an array of spaced-apart dams, each of which is associated with and circumscribes an open contact volume associated with one of the contacts. A dielectric material may cover the portion of the microelectronic component active surface that is external to the dams and extend between the spaced-apart dams.

Abstract: The spring-loaded contact probe electrically connects a semiconductor device, such as a device under test (DUT) with a substrate, such as a DUT board to be coupled with testing equipment. The probe comprises a barrel, two probes slidable within the barrel, and two isolated springs for loading the probes. The two isolated springs allow the probes to be engaged without affecting the connection of the opposite probe. The barrel housing the probes is securely attached within a socket. An array of these sockets may be used as a connector device between the DUT and DUT board.