Abstract: A device, method, and system for processing communications for secure operation of industrial control system field devices, includes: a processing device to be placed in-line between a Master Telemetry Unit (MTU) and a field device. A software verified microkernel includes instructions for the processing device to provide a secure partitioning of memory between a communication network interface address space, a security cell address space, and a field device interface address space. The security cell address space includes instructions to: receive communication messages from the MTU via the communication network interface address space; authenticate a user identification of each communication message; verify that an operation requested in each message is authorized for the user identification; and send each communication message having an authenticated user identification and a verified operation to the field network interface address space for communication with the field device.

Abstract: A security enhanced network device includes a processor, a memory, and a communication controller operably connected to form a processing device. A microkernel provides a partitioning between a communication address space, a security enforcement address space, and a protected operations address space. The communication address space contains communications threads for interacting with a network. The protected operations address space contains protected operations threads for performing protected operations. The security enforcement address space contains security threads for providing secure isolation of the protected operations address space from the communication address space.

Abstract: An apparatus and method are provided for an adaptive machining and weld repair process for repairing airfoils, damage to an airfoil leading edge and tip. First, damaged material is machined away from a damaged airfoil edge so as to expose a weld surface. New material is laser deposited on the weld surface so as to create a weld-repaired airfoil having actual dimensions. The actual dimensions of the weld-repaired airfoil are automatically measured using a CMM system so as to generate an actual geometry. The actual geometry is deformed so as to develop a deformation geometry. The component is then machined according to the deformation geometry.

Abstract: An inhaler is disclosed which delivers medicament or other appropriate fluids to a user, typically in droplet form and typically during inhalation. One embodiment of the inhaler includes an inhaler housing, an airflow conduit assembly which at least extends through the inhaler housing, a mouthpiece which is at least fluidly interconnectable with the airflow conduit assembly, a droplet ejection cartridge housing which is at least partially disposed within the airflow conduit assembly, and a droplet ejection cartridge which is removably disposed within the droplet ejection cartridge housing. Dosing of the medicament can be controlled by the measurement of airflow through the device. Droplets of medicament which are discharged by the droplet ejection cartridge are entrained in the flow of air which is drawn through the airflow conduit assembly by the user's inhalation and are discharged from the inhaler through the mouthpiece.

Abstract: This invention relates to apparatus for and methods of bonding a component to a substrate. More particularly, this invention relates to apparatus for and methods of removing small components, such a dies or other electrical components, from a wafer and bonding the components to a substrate.

Abstract: Apparatus for and methods of bonding electrical components or semiconductor chips to a substrate or lead frame is disclosed. According to the present invention, a sawn semiconductor wafer is held upside down in a first substantially horizontal plane and the substrate or lead frame to which it is to be bound is held in a second plane which is below and substantially parallel to the first plane. A die eject head located above the sawn wafer cooperates with a die bond head located between the wafer and the substrate to remove an individual die from the sawn wafer. The die bond head then rotates about an axis which is parallel to both planes and places the die on the lead frame. Also included is a transducer means which is responsive to electrical stimulus for actuating the die eject head and the die bond head such that the interactive force between the heads and the component may be precisely controlled.