Abstract: A method of cooling a heat source, such as an integrated circuit device, includes the following steps (1) providing a base having a plurality of elongated fins on a first side thereof and a mating surface on a second side thereof, with the plurality of elongated fins defining a plurality of channels, (2) positioning the mating surface of the base in contact with the integrated circuit device, (3) advancing a first flow of fluid onto a top surface of each of the plurality of fins so as to form a quantity of spent fluid which continues to be advanced into the plurality of channels, and (4) advancing a second flow of fluid into the plurality of channels so as to exhaust the quantity of spent fluid from the plurality of channels. An apparatus for cooling a heat source is also disclosed.