Patents by Inventor James A. Mahler

James A. Mahler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for applying flux to a substrate
    Patent number: 4871105
    Abstract: A controlled amount of flux is applied to a circuit board (10) by first directing liquid flux through a nozzle (54) containing means for disintegrating the flux into a very fine fog of tiny flux droplets (62). The fog of flux droplets is injected into a laminar gas stream (52), thereby creating a laminar flux stream which is directed at the circuit board to coat the board with flux. As the flux spray is being directed at the circuit board, the concentration of flux solids on the board is being regulated, typically by controlling the rate of flux pumped into the nozzle.
    Type: Grant
    Filed: February 1, 1989
    Date of Patent: October 3, 1989
    Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories
    Inventors: John R. Fisher, Leslie A. Guth, James A. Mahler
  • Method and apparatus for applying flux to a substrate
    Patent number: 4821948
    Abstract: A controlled amount of flux is applied to a circuit board (10) by first directing liquid flux through a nozzle (54) containing means for disintegrating the flux into a very fine fog of tiny flux droplets (62). The fog of flux droplets is injected into a laminar gas stream (52), thereby creating a laminar flux stream which is directed at the circuit board to coat the board with flux. As the flux spray is being directed at the circuit board, the concentration of flux solids on the board is being regulated, typically by controlling the rate of flux pumped into the nozzle.
    Type: Grant
    Filed: April 6, 1988
    Date of Patent: April 18, 1989
    Assignee: American Telephone and Telegraph Company
    Inventors: John R. Fisher, Leslie A. Guth, James A. Mahler
  • Method and apparatus for achieving reduced component failure during soldering
    Patent number: 4648547
    Abstract: Failure of an electronic component (18) during soldering of leads (16--16) thereof to a substrate (12) can be reduced by directing a gas such as air across the top surface (13) of the substrate against the leads. The gas directed against the leads serves to drive off corrosive flux vapors which would otherwise migrate upwardly along the leads causing corrosion thereto and failure of the component.
    Type: Grant
    Filed: June 26, 1985
    Date of Patent: March 10, 1987
    Assignee: AT&T Technologies, Inc.
    Inventors: James A. Mahler, Gregory C. Munie
  • Inductive coil module
    Patent number: 4195201
    Abstract: A plurality of inductive coils (FIG. 4; 10--10) are mounted in a coil module (30) which is comprised of an elongated housing (31) having a substantially oval cross section. A potting compound (44) encapsulates the mounted coils (10--10) and a layer of epoxy (46) covers the compound. Leads (11 and 12) from the coils (10--10) are attached to a pair of connectors (42 and 43) which are partially embedded in the epoxy (46) and project through an opening (32) in the housing (31).
    Type: Grant
    Filed: May 10, 1978
    Date of Patent: March 25, 1980
    Assignee: Western Electric Company, Incorporated
    Inventors: Frank J. Gryl, Jr., James A. Mahler