Patents by Inventor James A. Malcolm
James A. Malcolm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10599040Abstract: A method of determining compatibility of a patterning device with a lithographic apparatus. The method includes determining an intensity distribution of a conditioned radiation beam across a sensor plane of an illumination system of the lithographic apparatus. The method further includes using the determined intensity distribution to calculate a non-uniformity of intensity caused by contamination and/or degradation of a collector. The method further includes determining the effect of the non-uniformity on a characteristic of an image of the patterned radiation beam. The method further includes determining the compatibility of the patterning device with the lithographic apparatus based on the effect of the non-uniformity on the characteristic.Type: GrantFiled: July 20, 2018Date of Patent: March 24, 2020Assignee: ASML Netherland B.V.Inventors: James Malcolm Weidman, Franciscus Johannes Blok, Erika Jane Prime, Juliane Charlotte Behrend
-
Patent number: 10555874Abstract: Systems, methods, and computer-readable media for a healthcare management service are provided.Type: GrantFiled: June 12, 2017Date of Patent: February 11, 2020Assignee: Pillo, Inc.Inventors: Aiden Y. Feng, Emanuele Musini, James Malcolm Andrew Wyman, Emanuele Baglini, Antonello Scalmato, Paolo Vernazza, Simone Denei, Andrea Dulach, Alfonso Desiderio, Luca Petacchi
-
Patent number: 10529485Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.Type: GrantFiled: August 20, 2019Date of Patent: January 7, 2020Assignee: SUMIDA CORPORATIONInventors: Shinichi Sakamoto, Douglas James Malcolm
-
Publication number: 20190371524Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.Type: ApplicationFiled: August 20, 2019Publication date: December 5, 2019Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
-
Patent number: 10431378Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.Type: GrantFiled: April 16, 2019Date of Patent: October 1, 2019Assignee: SUMIDA CORPORATIONInventors: Shinichi Sakamoto, Douglas James Malcolm
-
Publication number: 20190244753Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.Type: ApplicationFiled: April 16, 2019Publication date: August 8, 2019Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
-
Patent number: 10318001Abstract: Techniques are described for dynamically determining the flow of screens to be presented in a user interface (UI) of an application executing on a computing device, based at least partly on a detected presence of a user device (e.g., a portable computing device) in a particular geographic area. Area designation data is transmitted to, and stored on, a user device. The area designation data can describe a geofenced area and/or beacon signals. In response to determining that the user device is in the geographic area indicated by the area designation data, the user device may transmit an alert signal that causes an interface flow to be dynamically determined and executed for an application executing on the computing device that is separate from the user device.Type: GrantFiled: April 26, 2017Date of Patent: June 11, 2019Assignee: United Services Automobile Association (USAA)Inventors: James Malcolm Spears, John David Clark, Lisa Horgan, John David Windham
-
Patent number: 10304624Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.Type: GrantFiled: October 6, 2017Date of Patent: May 28, 2019Assignee: SUMIDA CORPORATIONInventors: Shinichi Sakamoto, Douglas James Malcolm
-
Publication number: 20190131050Abstract: An inductor having a monolithic core that has a void or space underneath. In some embodiments, the core comprises multiple core pieces; in other embodiments, the core comprises a unitary core piece. The void allows for other electrical components to be mounted underneath the inductor, on the PCB or other substrate to which the inductor is to be mounted. The inductor may have one or more coils, and each coil may be a single turn or a multi-turn coil. The coils can be embedded within the core once the inductor is assembled. The inductor may have an air gap within the core.Type: ApplicationFiled: August 29, 2018Publication date: May 2, 2019Inventors: Hamid DANESH pajooh nejad, Douglas James MALCOLM
-
Publication number: 20190056669Abstract: A method of determining compatibility of a patterning device with a lithographic apparatus. The method includes determining an intensity distribution of a conditioned radiation beam across a sensor plane of an illumination system of the lithographic apparatus. The method further includes using the determined intensity distribution to calculate a non-uniformity of intensity caused by contamination and/or degradation of a collector. The method further includes determining the effect of the non-uniformity on a characteristic of an image of the patterned radiation beam. The method further includes determining the compatibility of the patterning device with the lithographic apparatus based on the effect of the non-uniformity on the characteristic.Type: ApplicationFiled: July 20, 2018Publication date: February 21, 2019Applicants: ASML NETHERLANDS B.V., ASML Holding N.V.Inventors: James Malcolm WEIDMAN, Franciscus Johannes BLOK, Erika Jane PRIME, Juliane Charlotte BEHREND
-
Patent number: 10148172Abstract: A power supply module is disclosed. The power supply module includes: a coil including a coil body and connecting ends; electronic components including at least an integrated circuit chip; a magnetic core which encloses the coil body, wherein at least one side of the magnetic core has a cavity provided therein, and the at least one electronic component is positioned in the cavity; a connector, which abuts against the side of the magnetic core having the cavity therein, covers the surface of the side, and is electronically connected to the coil and the electronic components. The power supply module is able to reduce the damage to the integrated circuit chip, decrease electromagnetic interferences and achieve an excellent cooling effect.Type: GrantFiled: February 26, 2013Date of Patent: December 4, 2018Assignee: Sumida Electric (H.K.) Company LimitedInventors: Douglas James Malcolm, Yanfei Liu, Guoping Zhang, Zhuo Wu, Hongnian Zhang, Xinliang Luo
-
Patent number: 10080297Abstract: A power supply module and a method for manufacturing the same are disclosed. The power supply module includes: a coil including a coil body and a connecting terminal; electronic components at least including an integrated circuit chip; a connector configured to be electrically connected with the coil and the electronic component; and a magnetic conductor configured to enclose in and around the coil body and the electronic component, wherein the connector is integrally formed with the integrated circuit chip when manufacturing the latter. The present disclosure can make the structure of the power supply module be more compact to further meet the needs of miniaturization design, reduce material consumption, simplify procedure, and therefore reduce the production costs.Type: GrantFiled: April 30, 2014Date of Patent: September 18, 2018Assignee: Sumida Electric (H.K.) Company LimitedInventors: Zhuo Wu, Douglas James Malcolm, Yanfei Liu
-
Patent number: 9907184Abstract: A power supply module and its manufacturing method are disclosed. The manufacturing method for the power supply module includes: configuring a coil such that coil terminals are configured by way of electrical connection in the preset circuit connection configuration of the connector; preparing a mold cavity, and placing the connector housed with the coil and the electronic components into the mold cavity; making a magnetic mixture, and filling the mold cavity where the connector is placed with the magnetic mixture to form a magnetic body under pressure, wherein the magnetic body encapsulates at least the coil, the electronic components and a portion of the connector adapted to house the coil and the electronic components, and the terminal is exposed outside the magnetic body; demolding the magnetic body from the mold cavity; and increasing the temperature of the demolded magnetic body by heating.Type: GrantFiled: September 4, 2015Date of Patent: February 27, 2018Assignee: SUMIDA ELECTRIC (H.K.) COMPANY LIMITEDInventors: Hongnian Zhang, Yanfei Liu, Douglas James Malcolm
-
Publication number: 20180033551Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.Type: ApplicationFiled: October 6, 2017Publication date: February 1, 2018Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
-
Patent number: 9818534Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.Type: GrantFiled: June 9, 2015Date of Patent: November 14, 2017Assignee: SUMIDA CORPORATIONInventors: Shinichi Sakamoto, Douglas James Malcolm
-
Patent number: 9773607Abstract: A coil with variable inner diameter is disclosed. The coil includes a coil body consisting of a plurality of turns of winding, and a connecting terminal configured to be connected to an external device, wherein the winding is wound to form at least two different inner diameters. And an electronic module made from the coil with variable inner diameter is also disclosed. The electronic module includes: electronic components including at least an integrated circuit chip; a coil with variable inner diameter, including a coil body having at least two different inner diameters and a connecting terminal; a connector, configured to be electrically connected with the electronic component and the coil; and a magnetic conductor, configured to enclose in and around the coil body and the electronic component.Type: GrantFiled: April 30, 2014Date of Patent: September 26, 2017Assignee: Sumida Electric (H.K.) Company LimitedInventors: Hongnian Zhang, Douglas James Malcolm, Yanfei Liu
-
Patent number: 9720996Abstract: A system dependencies tracking application for large scale Information Technology (IT) systems is provided. In one embodiment, a computing system may capture information related to components of an information technology system and relationship information between each component of the information technology system. The computing system may also store the information related to the components and the relationship information in a database.Type: GrantFiled: April 22, 2013Date of Patent: August 1, 2017Assignee: Open Invention Network LLCInventor: James Malcolm Sweatt
-
Patent number: D810989Type: GrantFiled: September 1, 2016Date of Patent: February 20, 2018Assignee: Dyson Technology LimitedInventors: Jacob Dyson, William John Darvill, Alexander James Morrison, Michael Graham Love, Paul Dominic Whittaker, James Malcolm Stuart Bray, David James Hill
-
Patent number: D814684Type: GrantFiled: September 1, 2016Date of Patent: April 3, 2018Assignee: Dyson Technology LimitedInventors: Jacob Dyson, William John Darvill, Alexander James Morrison, Michael Graham Love, Paul Dominic Whittaker, James Malcolm Stuart Bray, David James Hill
-
Patent number: D814685Type: GrantFiled: September 1, 2016Date of Patent: April 3, 2018Assignee: Dyson Technology LimitedInventors: Jacob Dyson, William John Darvill, Alexander James Morrison, Paul Dominic Whittaker, James Malcolm Stuart Bray, David James Hill