Patents by Inventor James A. Malcolm

James A. Malcolm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10599040
    Abstract: A method of determining compatibility of a patterning device with a lithographic apparatus. The method includes determining an intensity distribution of a conditioned radiation beam across a sensor plane of an illumination system of the lithographic apparatus. The method further includes using the determined intensity distribution to calculate a non-uniformity of intensity caused by contamination and/or degradation of a collector. The method further includes determining the effect of the non-uniformity on a characteristic of an image of the patterned radiation beam. The method further includes determining the compatibility of the patterning device with the lithographic apparatus based on the effect of the non-uniformity on the characteristic.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: March 24, 2020
    Assignee: ASML Netherland B.V.
    Inventors: James Malcolm Weidman, Franciscus Johannes Blok, Erika Jane Prime, Juliane Charlotte Behrend
  • Patent number: 10555874
    Abstract: Systems, methods, and computer-readable media for a healthcare management service are provided.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: February 11, 2020
    Assignee: Pillo, Inc.
    Inventors: Aiden Y. Feng, Emanuele Musini, James Malcolm Andrew Wyman, Emanuele Baglini, Antonello Scalmato, Paolo Vernazza, Simone Denei, Andrea Dulach, Alfonso Desiderio, Luca Petacchi
  • Patent number: 10529485
    Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: January 7, 2020
    Assignee: SUMIDA CORPORATION
    Inventors: Shinichi Sakamoto, Douglas James Malcolm
  • Publication number: 20190371524
    Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.
    Type: Application
    Filed: August 20, 2019
    Publication date: December 5, 2019
    Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
  • Patent number: 10431378
    Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: October 1, 2019
    Assignee: SUMIDA CORPORATION
    Inventors: Shinichi Sakamoto, Douglas James Malcolm
  • Publication number: 20190244753
    Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.
    Type: Application
    Filed: April 16, 2019
    Publication date: August 8, 2019
    Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
  • Patent number: 10318001
    Abstract: Techniques are described for dynamically determining the flow of screens to be presented in a user interface (UI) of an application executing on a computing device, based at least partly on a detected presence of a user device (e.g., a portable computing device) in a particular geographic area. Area designation data is transmitted to, and stored on, a user device. The area designation data can describe a geofenced area and/or beacon signals. In response to determining that the user device is in the geographic area indicated by the area designation data, the user device may transmit an alert signal that causes an interface flow to be dynamically determined and executed for an application executing on the computing device that is separate from the user device.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: June 11, 2019
    Assignee: United Services Automobile Association (USAA)
    Inventors: James Malcolm Spears, John David Clark, Lisa Horgan, John David Windham
  • Patent number: 10304624
    Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: May 28, 2019
    Assignee: SUMIDA CORPORATION
    Inventors: Shinichi Sakamoto, Douglas James Malcolm
  • Publication number: 20190131050
    Abstract: An inductor having a monolithic core that has a void or space underneath. In some embodiments, the core comprises multiple core pieces; in other embodiments, the core comprises a unitary core piece. The void allows for other electrical components to be mounted underneath the inductor, on the PCB or other substrate to which the inductor is to be mounted. The inductor may have one or more coils, and each coil may be a single turn or a multi-turn coil. The coils can be embedded within the core once the inductor is assembled. The inductor may have an air gap within the core.
    Type: Application
    Filed: August 29, 2018
    Publication date: May 2, 2019
    Inventors: Hamid DANESH pajooh nejad, Douglas James MALCOLM
  • Publication number: 20190056669
    Abstract: A method of determining compatibility of a patterning device with a lithographic apparatus. The method includes determining an intensity distribution of a conditioned radiation beam across a sensor plane of an illumination system of the lithographic apparatus. The method further includes using the determined intensity distribution to calculate a non-uniformity of intensity caused by contamination and/or degradation of a collector. The method further includes determining the effect of the non-uniformity on a characteristic of an image of the patterned radiation beam. The method further includes determining the compatibility of the patterning device with the lithographic apparatus based on the effect of the non-uniformity on the characteristic.
    Type: Application
    Filed: July 20, 2018
    Publication date: February 21, 2019
    Applicants: ASML NETHERLANDS B.V., ASML Holding N.V.
    Inventors: James Malcolm WEIDMAN, Franciscus Johannes BLOK, Erika Jane PRIME, Juliane Charlotte BEHREND
  • Patent number: 10148172
    Abstract: A power supply module is disclosed. The power supply module includes: a coil including a coil body and connecting ends; electronic components including at least an integrated circuit chip; a magnetic core which encloses the coil body, wherein at least one side of the magnetic core has a cavity provided therein, and the at least one electronic component is positioned in the cavity; a connector, which abuts against the side of the magnetic core having the cavity therein, covers the surface of the side, and is electronically connected to the coil and the electronic components. The power supply module is able to reduce the damage to the integrated circuit chip, decrease electromagnetic interferences and achieve an excellent cooling effect.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: December 4, 2018
    Assignee: Sumida Electric (H.K.) Company Limited
    Inventors: Douglas James Malcolm, Yanfei Liu, Guoping Zhang, Zhuo Wu, Hongnian Zhang, Xinliang Luo
  • Patent number: 10080297
    Abstract: A power supply module and a method for manufacturing the same are disclosed. The power supply module includes: a coil including a coil body and a connecting terminal; electronic components at least including an integrated circuit chip; a connector configured to be electrically connected with the coil and the electronic component; and a magnetic conductor configured to enclose in and around the coil body and the electronic component, wherein the connector is integrally formed with the integrated circuit chip when manufacturing the latter. The present disclosure can make the structure of the power supply module be more compact to further meet the needs of miniaturization design, reduce material consumption, simplify procedure, and therefore reduce the production costs.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: September 18, 2018
    Assignee: Sumida Electric (H.K.) Company Limited
    Inventors: Zhuo Wu, Douglas James Malcolm, Yanfei Liu
  • Patent number: 9907184
    Abstract: A power supply module and its manufacturing method are disclosed. The manufacturing method for the power supply module includes: configuring a coil such that coil terminals are configured by way of electrical connection in the preset circuit connection configuration of the connector; preparing a mold cavity, and placing the connector housed with the coil and the electronic components into the mold cavity; making a magnetic mixture, and filling the mold cavity where the connector is placed with the magnetic mixture to form a magnetic body under pressure, wherein the magnetic body encapsulates at least the coil, the electronic components and a portion of the connector adapted to house the coil and the electronic components, and the terminal is exposed outside the magnetic body; demolding the magnetic body from the mold cavity; and increasing the temperature of the demolded magnetic body by heating.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: February 27, 2018
    Assignee: SUMIDA ELECTRIC (H.K.) COMPANY LIMITED
    Inventors: Hongnian Zhang, Yanfei Liu, Douglas James Malcolm
  • Publication number: 20180033551
    Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.
    Type: Application
    Filed: October 6, 2017
    Publication date: February 1, 2018
    Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
  • Patent number: 9818534
    Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: November 14, 2017
    Assignee: SUMIDA CORPORATION
    Inventors: Shinichi Sakamoto, Douglas James Malcolm
  • Patent number: 9773607
    Abstract: A coil with variable inner diameter is disclosed. The coil includes a coil body consisting of a plurality of turns of winding, and a connecting terminal configured to be connected to an external device, wherein the winding is wound to form at least two different inner diameters. And an electronic module made from the coil with variable inner diameter is also disclosed. The electronic module includes: electronic components including at least an integrated circuit chip; a coil with variable inner diameter, including a coil body having at least two different inner diameters and a connecting terminal; a connector, configured to be electrically connected with the electronic component and the coil; and a magnetic conductor, configured to enclose in and around the coil body and the electronic component.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: September 26, 2017
    Assignee: Sumida Electric (H.K.) Company Limited
    Inventors: Hongnian Zhang, Douglas James Malcolm, Yanfei Liu
  • Patent number: 9720996
    Abstract: A system dependencies tracking application for large scale Information Technology (IT) systems is provided. In one embodiment, a computing system may capture information related to components of an information technology system and relationship information between each component of the information technology system. The computing system may also store the information related to the components and the relationship information in a database.
    Type: Grant
    Filed: April 22, 2013
    Date of Patent: August 1, 2017
    Assignee: Open Invention Network LLC
    Inventor: James Malcolm Sweatt
  • Patent number: D810989
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: February 20, 2018
    Assignee: Dyson Technology Limited
    Inventors: Jacob Dyson, William John Darvill, Alexander James Morrison, Michael Graham Love, Paul Dominic Whittaker, James Malcolm Stuart Bray, David James Hill
  • Patent number: D814684
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: April 3, 2018
    Assignee: Dyson Technology Limited
    Inventors: Jacob Dyson, William John Darvill, Alexander James Morrison, Michael Graham Love, Paul Dominic Whittaker, James Malcolm Stuart Bray, David James Hill
  • Patent number: D814685
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: April 3, 2018
    Assignee: Dyson Technology Limited
    Inventors: Jacob Dyson, William John Darvill, Alexander James Morrison, Paul Dominic Whittaker, James Malcolm Stuart Bray, David James Hill