Abstract: A spacer device for mounting electrical components on a printed wire board includes a spacer having two legs projecting from a body to form a general U-shape. Each of the legs has a slot formed in its end wall for receiving and retaining one of the wire leads of an electrical component. During mounting of the electrical component, the spacer device is snapped onto the component by force fitting the component leads into the respective slots in the spacer legs such that the component is held beween the spacer legs. The spacer device remains attached to the electrical component during soldering and provides, by virtue of the thickness of one of the spacer legs, the required spacing of the component from the printed wire board. After soldering, the spacer device can be retained on the component and moved radially about the component to permit inspection of the component solder joint. Alternately, the spacer device can be removed after soldering by simply unsnapping it from the component leads.