Abstract: Methods, systems, and devices for repair techniques for coupled host and memory dies are described. For example, to distribute memory access circuitry among multiple semiconductor dies of a stack, a first die may include a set of one or more memory arrays and a first portion of circuitry configured to access the set of memory arrays, and a second die may include a second portion of circuitry configured to access the set of memory arrays. The second portion of the circuitry (e.g., of the second die) may be configured to support various repair techniques for operations with the set of memory arrays, including techniques in response to column failures or serialization failures associated with the first die, or in response to contact or other interconnection failures with or between the first die and the second die, among other techniques that may be differentiated based on an attribution of error conditions.

Abstract: Methods, systems, and devices for thermal distribution techniques in coupled semiconductor systems are described. A semiconductor system may be formed by coupling various semiconductor components with one another, and may also implement a semiconductor material to support a thermal path having a thermal conductivity that is relatively close to a thermal conductivity through the coupled semiconductor components of the semiconductor system. Such a semiconductor material may be located in regions of the semiconductor system that are otherwise unoccupied by functional (e.g., electrically operable) semiconductor components and may, in some examples, be electrically inoperable (e.g., may lack functional circuitry). For implementations in which functional semiconductor components are directly coupled (e.g., by fusion bonding or hybrid bonding techniques), the semiconductor material may also be directly coupled with at least one of the semiconductor components.

Abstract: A non-antimicrobial cleansing composition is disclosed comprising from about 10.0 wt. % to less than about 40 wt. % of one or more C1-C8 alcohols; about 0.5 wt. % to about 10.0 wt. % of at least one primary surfactant; 0 wt. % to about 10.0 wt. % of at least one secondary surfactant, with the primary and secondary surfactants having an HLB value greater than 8; a pH adjusting agent; and water. The composition does not achieve a microbial kill level greater than 2.0 log.

Abstract: Methods, systems, and devices for techniques for coupled host and memory dies are described. For example, to distribute memory access circuitry among multiple semiconductor dies of a stack, a first die may include a set of one or more memory arrays and a first portion of the circuitry configured to access the set of memory arrays, and a second die may include a second portion of the circuitry configured to access the set of memory arrays. The first portion and the second portion of the circuitry configured to access a set of memory arrays may be communicatively coupled between the dies using various interconnection techniques, such as a fusion of conductive contacts of the respective memory dies. In some examples, the second die may also include the host itself (e.g., a host processor).

Abstract: An implantable medical device is adapted to be implanted at an implantation site within the vasculature and is capable of being implanted at the implantation site within the vasculature at more than one position relative to the implantation site. This may include a relative axial position and/or a relative rotational position. The implantable medical device includes an expandable frame that is adapted to expand from a collapsed configuration for delivery to an expanded configuration for deployment, and one or more radiopaque markers disposed relative to the expandable frame such that fluoroscopic imaging of the implantable medical device during deployment provides an indication of a position of the implantable medical device relative to the implantation site. The implantable medical device may be a replacement cardiac valve such as a replacement aortic valve, for example.

Abstract: A cooling module, which is securable to one or more thermal transfer members for an LED curing apparatus, wherein the cooling module comprises a first finned heat sink and a second finned heat sink; wherein the first finned heat sink is removably securable to the second finned heat sink to provide at least one aperture therebetween, wherein each of a plurality of fins protrude from the first finned heat sink and from the second finned heat sink and each fin is substantially perpendicular to the length of the or each aperture, wherein the first finned heat sink is removably secured proximal to the second finned heat sink by at least one locking member, and wherein the or each locking member is inserted such that its length is parallel to the length of the or each aperture.

Abstract: Methods, systems, and devices for memory with parallel main and test interfaces are described. A memory die may be configured with parallel interfaces that may individually (e.g., separately) support evaluation operations (e.g., before or as part of assembly in a multiple-die stack) or access operations (e.g., after assembly in a multiple die stack). For example, a memory die may include a first set of one or more contacts that support communicating signaling with or via another memory die in a multiple-die stack. The memory die may also include a second set of one or more contacts that support probing for pre-assembly evaluations, which may be electrically isolated from the first set of contacts. By implementing such parallel interfaces, evaluation operations may be performed using the second set of contacts without damaging the first set of contacts, which may improve capabilities for supporting a multiple-die stack in a memory device.

Abstract: This invention provides for a solid, particulate insecticidal formulation in the form of a granule, a bait or a tablet for mechanical incorporation into or onto soil comprising a volatile insecticidal active ingredient that is microencapsulated and combined with a bulking agent and a disintegrating agent. The solid particulate formulation is characterized in that the volatile insecticide is selected from insecticidal active ingredients having: (a) a vapour pressure at 25° C. in the range from about 1 mPa to about 1,000 mPa; and (b) a water solubility at 25° C. less than about 100 mg/Litre.

Abstract: Described is a broad spectrum, synergistic fungicidal composition when used for the preservation of a glued wood product comprising as active ingredients: (A) triadimefon, and (B) cyproconazole characterised in that the weight ratio of (A):(B) is from about 20:1 to about 1:1, the composition being further characterised in that the application rate for the composition is from about 10 gai/m3 to about 6,000 gai/m3.

Abstract: Described is a broad spectrum, synergistic fungicidal composition when used for the preservation of a glued wood product comprising as active ingredients: (A) triadimefon, and (B) cyproconazole characterised in that the weight ratio of (A):(B) is from about 20:1 to about 1:1, the composition being further characterised in that the application rate for the composition is from about 10 gai/m3 to about 6,000 gai/m3.

Abstract: Described is a broad spectrum, synergistic fungicidal composition when used for the preservation of a glued wood product comprising as active ingredients: (A) triadimefon, and (B) cyproconazole characterized in that the weight ratio of (A):(B) is from about 20:1 to about 1:1, the composition being further characterized in that the application rate for the composition is from about 10 gai/m3 to about 6,000 gai/m3.

Abstract: A method of incorporating biocides into wood or a wood product, the method including the steps of synthesizing a plurality of capsules each having an outer shell of polymer and incorporating within each said capsule an additive which includes an organic biocide, and then applying the said capsules to the wood or wood product in a manner whereby the capsules penetrate the wood or wood product.

Abstract: A method of incorporating biocides into wood or a wood product, the method including the steps of synthesising a plurality of capsules each having an outer shell of polymer and incorporating within each said capsule an additive which includes an organic biocide, and then applying the said capsules to the wood or wood product in a manner whereby the capsules penetrate the wood or wood product.

Abstract: A system for subsea imaging comprises a first plate having an inner surface, an outer surface, and a cavity formed in the inner surface. In addition, the system comprises a phosphor imaging plate disposed in the cavity. Further, the system comprises a second plate having an inner surface facing the inner surface of the first plate and an outer surface facing away from the outer surface of the first plate. Still further, the system comprises a seal member disposed between the inner surface of the first plate and the inner surface of the second plate. The seal member extends around the perimeter of the cavity and is configured to seal the phosphor imaging plate and the cavity from intrusion water.

Abstract: A method of incorporating biocides into wood or a wood product, the method including the steps of synthesising a plurality of capsules each having an outer shell of polymer and incorporating within each said capsule an additive which includes an organic biocide, and then applying the said capsules to the wood or wood product in a manner whereby the capsules penetrate the wood or wood product.

Abstract: Described is a broad spectrum, synergistic fungicidal composition when used for the preservation of a glued wood product comprising as active ingredients: (A) triadimefon, and (B) cyproconazole characterised in that the weight ratio of (A):(B) is from about 20:1 to about 1:1, the composition being further characterised in that the application rate for the composition is from about 10 gai/m3 to about 6,000 gai/m3

Abstract: A composition for surface treatment of timber and wood products that provides protection against insect damage to all surfaces without any need for a secondary insecticide treatment of one or more new, untreated surfaces generated by post-treatment processing operations including sawing, cutting, drilling, bevelling, planing, sanding and/or a combination thereof, comprising one or more non-repellent insecticides.

Abstract: A system for subsea imaging comprises a first plate having an inner surface, an outer surface, and a cavity formed in the inner surface. In addition, the system comprises a phosphor imaging plate disposed in the cavity. Further, the system comprises a second plate having an inner surface facing the inner surface of the first plate and an outer surface facing away from the outer surface of the first plate. Still further, the system comprises a seal member disposed between the inner surface of the first plate and the inner surface of the second plate. The seal member extends around the perimeter of the cavity and is configured to seal the phosphor imaging plate and the cavity from intrusion water.

Abstract: A composition for modification of wood products is disclosed. The composition contains a prepolymer formed by the reaction of a polyfunctional hydrophilic polymer of high molecular weight and a crosslinking agent. The composition may also contain a prepolymer formed by the reaction of a sugar and a crosslinking agent. Modification of the wood product may result in one or more of: improved stiffness, strength, surface hardness, dimensional stability, water resistance, flame retardancy, and biological resistance.

Abstract: A composition for surface treatment of timber and wood products that provides protection against insect damage to all surfaces without any need for a secondary insecticide treatment of one or more new, untreated surfaces generated by post-treatment processing operations including sawing, cutting, drilling, beveling, planing, sanding and/or a combination thereof, comprising one or more non-repellent insecticides.