Abstract: A transport/stacker module provides for a vertical stacking of mail bins. Carriers traveling in a transport path have openable and closable doors at both ends, and a frame of the transport/stacker module is provided with cam actuators to open the doors after the carriers pass turnaround areas and close the doors before the carriers enter the turnaround areas. A rake mechanism disposed above each bin is provided with a snubber which engages a mail piece prior to rake tines of the rake mechanism.

Abstract: A method and an apparatus for depositing solder onto component lead pads of a printed wiring board. Solder preforms which are multi-layer, solder containing members are positively biased against the pwb pad which is then introduced into a vapor phase environment defining a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The pwb is heated according to a controlled process in which the temperature of the pwb is continuously monitored.

Abstract: A method for vapor phase soldering components onto a PWB onto which solder has been previously deposited includes the steps of applying a fluxing agent on the PWB and introducing the PWB into a vapor phase environment. The application of flux is a multi-step process which includes a sequential application of flux to the PWB. The vapor phase environment defines a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The PWB is heated according to a controlled process in which the temperature of the PWB is continuously monitored.

Abstract: An apparatus for printed wiring board assembly provides for the populating with components of a printed wiring board having at least one adjacent pair of pad rows onto which solder has been deposited. A curable adhesive strip is applied between the adjacent pair of pad rows. The adhesive strip has a first adhesive side which adheres to the printed wiring board and an opposed, second adhesive side onto which the components are selectively mounted so that the component's leads are aligned with the pad rows. A predetermined constant force is applied to the components and the adhesive strip is cured. The apparatus supports the printed wiring board and maintains a predetermined constant force on the components. A frame defining a generally U-shaped member has an upper and a lower surface. The U-shaped member has a slot therein for receiving the printed wiring board therein. An upper and a lower cover member are removably secured to the U-shaped member to generally enclose the printed wiring board.

Abstract: A method and an apparatus for depositing solder onto component lead pads of a printed wiring board. Solder preforms which are multi-layer, solder containing members are positively biased against the pwb pad which is then introduced into a vapor phase environment defining a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The pwb is heated according to a controlled process in which the temperature of the pwb is continuously monitored.

Abstract: A mechanically deformable heat transfer fin for installation in a hollow cavity of a large complex elongated extrusion to improve heat transfer characteristics without brazing welding or glueing. Since the required design cannot be obtained with the transfer fins as an integral part of the extrusion using presently known techniques, a separate fin insert of slightly smaller dimensions than the hollow opening of the large extrusion is installed therein. The insert includes a plurality of legs and an internal pressure cavity which can be sealed off at both ends with pressure cap fittings secured by tie rods. After installation in the extrusion, pressure is applied to the inner chamber until the legs of the insert move outward and contact the inner surface of the extrusion walls. The pressure is raised until the relatively thin walls of the insert are permanently deformed so that, when the pressure is relieved, the insert is held fixedly in place.

Abstract: A clamping device for securing a workpiece such as an electronic package to a support such as a heat sink. A curved slot is machined around a central opening in the body of a configurated flat metal clamp having an extending lip which contacts the edge of the workpiece. The central opening in the clamp body receives a hold down screw member which threadably engages the support. When the hold down screw is fully tightened against the support with the extending lip over the workpiece, the known clamping force predetermined by the thickness and configuration of the clamp body is applied. The need for a torque wrench and specific fastener torque values to prevent possible distortion of the surface of the heat sink is eliminated.