Abstract: An electrically conductive epoxy-based adhesive. The epoxy is selected from the amine curing modified epoxy family consisting of a resin that is a combination of polyglycidylaminophenyl resin and polygylcidylether of phenylformaldehyde novalac resin family, and a catalyst that is a combination of one member from the aliphatic amide family plus one member from the aliphatic polyamine family. In one embodiment includes 17 parts by weight of the resin and 10 parts by weight of the catalyst. 73 parts by weight of a mixture of properly shaped silver flake particles are added. The resulting adhesive is curable at room temperature to provide a high-temperature, high-strength, electrically conductive adhesive.