Abstract: Monolithic capacitors are produced by (1) providing on a plurality of thin leaves or sheets of suitable finely divided ceramic material bonded with a thermally-fugitive temporary bond, coatings comprising thin, selected patterns of pseudo-conductive material that consists essentially of thermally-fugitive material, one or more ceramic or metal granules, and a thermally-fugitive bond; (2) forming a consolidated stack from a plurality of the coated leaves or sheets; (3) firing the resulting body to remove the thermally-fugitive materials and sinter the ceramic material into a monolithic body in which there are thin cavities or open spaces which are interrupted only by one or more distinct ceramic or metal pillars, substantially all of which, when there are a plurality, are distinct and separated; (4) introducing conductive material, preferably metal, into the resulting cavities; and (5) providing suitable electrical connections to the resulting conductive layers.

Abstract: A monolithic, multilayer, ceramic capacitor is formed by introducing molten metal into a matrix having thin electrode regions between dielectric strata, through holes, each of which extends through a face of said matrix and provides communication between the outside of said matrix and at least one of said regions, around wires or rods inserted in said holes, thereby providing external leads for said capacitor. A similar process is used to provide internal and external connectors for multilayer, ceramic, circuit boards.