Patents by Inventor James A. Tappan
James A. Tappan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11302556Abstract: A substrate support for control of a temperature of a semiconductor substrate supported thereon during plasma processing of the semiconductor substrate includes a temperature-controlled base having a top surface, a metal plate, and a film heater. The film heater is a thin and flexible polyimide heater film with a plurality of independently controlled resistive heating elements thermally coupled to an underside of the metal plate. The film heater is electrically insulated from the metal plate. A first layer of adhesive bonds the metal plate and the film heater to the top surface of the temperature-controlled base. A layer of dielectric material is bonded to a top surface of the metal plate with a second layer of adhesive. The layer of dielectric material forms an electrostatic clamping mechanism for supporting the semiconductor substrate.Type: GrantFiled: April 13, 2020Date of Patent: April 12, 2022Assignee: LAM RESEARCH CORPORATIONInventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Publication number: 20200251370Abstract: A substrate support for control of a temperature of a semiconductor substrate supported thereon during plasma processing of the semiconductor substrate includes a temperature-controlled base having a top surface, a metal plate, and a film heater. The film heater is a thin and flexible polyimide heater film with a plurality of independently controlled resistive heating elements thermally coupled to an underside of the metal plate. The film heater is electrically insulated from the metal plate. A first layer of adhesive bonds the metal plate and the film heater to the top surface of the temperature-controlled base. A layer of dielectric material is bonded to a top surface of the metal plate with a second layer of adhesive. The layer of dielectric material forms an electrostatic clamping mechanism for supporting the semiconductor substrate.Type: ApplicationFiled: April 13, 2020Publication date: August 6, 2020Inventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Patent number: 10636689Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus.Type: GrantFiled: July 24, 2014Date of Patent: April 28, 2020Assignee: LAM RESEARCH CORPORATIONInventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Patent number: 8900404Abstract: A plasma processing system with improved component temperature control is disclosed. The system may include a plasma processing chamber having a chamber wall. The system may also include an electrode disposed inside the plasma processing chamber. The system may also include a support member disposed inside the plasma processing chamber for supporting the electrode. The system may also include a support plate disposed outside the chamber wall. The system may also include a cantilever disposed through the chamber wall for coupling the support member with the support plate. The system may also include a lift plate disposed between the chamber wall and the support plate. The system may also include thermally resistive coupling mechanisms for mechanically coupling the lift plate with the support plate.Type: GrantFiled: May 19, 2009Date of Patent: December 2, 2014Assignee: Lam Research CorporationInventor: James Tappan
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Publication number: 20140332161Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus.Type: ApplicationFiled: July 24, 2014Publication date: November 13, 2014Inventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Patent number: 8821639Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus.Type: GrantFiled: September 19, 2011Date of Patent: September 2, 2014Assignee: Lam Research CorporationInventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Patent number: 8735298Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.Type: GrantFiled: October 22, 2012Date of Patent: May 27, 2014Assignee: Lam Research CorporationInventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Publication number: 20120018411Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus.Type: ApplicationFiled: September 19, 2011Publication date: January 26, 2012Applicant: Lam Research CorporationInventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Patent number: 8051556Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.Type: GrantFiled: September 22, 2008Date of Patent: November 8, 2011Assignee: Lam Research CorporationInventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Patent number: 8038796Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.Type: GrantFiled: December 30, 2004Date of Patent: October 18, 2011Assignee: Lam Research CorporationInventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Publication number: 20090301657Abstract: A plasma processing system with improved component temperature control is disclosed. The system may include a plasma processing chamber having a chamber wall. The system may also include an electrode disposed inside the plasma processing chamber. The system may also include a support member disposed inside the plasma processing chamber for supporting the electrode. The system may also include a support plate disposed outside the chamber wall. The system may also include a cantilever disposed through the chamber wall for coupling the support member with the support plate. The system may also include a lift plate disposed between the chamber wall and the support plate. The system may also include thermally resistive coupling mechanisms for mechanically coupling the lift plate with the support plate.Type: ApplicationFiled: May 19, 2009Publication date: December 10, 2009Inventor: James Tappan
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Publication number: 20090078360Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.Type: ApplicationFiled: September 22, 2008Publication date: March 26, 2009Applicant: Lam Research CorporationInventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Publication number: 20080033889Abstract: An information system for enabling a buyer subscriber and a seller subscriber to directly communicate, negotiate and order financial instruments, particularly fixed income instruments, without the need for an intermediary or inter-dealer broker. The information system is adapted to publish real-time bond offerings, provide search capabilities to allow users to locate bond offerings meeting specific criteria, send real-time notification of offerings entering the marketplace in which a user has a registered interest, manage and negotiate order privileges, provide a network for real-time communication between counter-parties in a transaction, and allow direct communication between a fully disclosed buyer subscriber and a fully disclosed seller subscriber. Also, the information system can cooperate or be integrated with existing industry systems, such as inventory management systems to import offering information, and back-office systems to export transaction information.Type: ApplicationFiled: August 3, 2006Publication date: February 7, 2008Inventors: James A. Tappan, Tommy J. Hannon, Jacob L. Massey, James B. Rucker, Christopher W. Trammell, David L. Trammell
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Publication number: 20070221837Abstract: In one embodiment, an analytical apparatus is provided that includes a carriage; and a plurality of electrospray probes pivotably mounted on the carriage, wherein movement of the carriage engages a feature with a selected one of the electrospray probes whereby movement of the feature pivots the selected one of the electrospray probes with respect to the carriage.Type: ApplicationFiled: March 22, 2006Publication date: September 27, 2007Inventors: Thomas Bailey, James Tappan
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Patent number: 7132080Abstract: An automated matrix removal module is configurable to automatically withdraw a portion of sample containing an interferent. The module is further configurable to mix the portion of sample with a precipitating reagent selected to react with the interferent to form a precipitant and then filter mixture of sample and precipitant reagent through a filter. Finally, the module is further configurable to flush the precipitant from the filter.Type: GrantFiled: August 15, 2003Date of Patent: November 7, 2006Assignee: Metara, Inc.Inventors: Marc R. Anderson, Michael J. West, James Tappan
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Publication number: 20060144516Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.Type: ApplicationFiled: December 30, 2004Publication date: July 6, 2006Inventors: Anthony Ricci, Keith Comendant, James Tappan
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Publication number: 20060133964Abstract: An automated matrix removal module is configurable to automatically withdraw a portion of sample containing an interfering matrix. The module is further configurable to mix the portion of sample with a reagent selected to react with the matrix to form a precipitant and then filter the mixture of sample and precipitant reagent through a filter. Finally, the module is further configurable to flush the precipitant from the filter.Type: ApplicationFiled: October 18, 2005Publication date: June 22, 2006Inventors: Thomas Bailey, Michael Ahern, Michael West, Qin Wang, Zhenbiao Wang, James Tappan
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Publication number: 20060128028Abstract: An in-process mass spectrometry (IPMS) system is disclosed that uses an internal standard to determine the concentration of an analyte in a sample. The internal standard has a different molecular composition than the analyte but is sufficiently similar chemically and physically to the analyte such that it behaves substantially the same as the analyte during an ionization process in the mass spectrometer.Type: ApplicationFiled: February 13, 2006Publication date: June 15, 2006Inventors: Marc Anderson, Michael West, James Tappan
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Publication number: 20060065523Abstract: In a plasma processing system, an integrated gas flow control assembly for connecting a gas distribution system to a multi-zone injector is disclosed. The assembly includes a first set of channels connecting the gas distribution system to a first valve assembly with a first flow rate, a second valve assembly with a second flow rate, a third flow assembly with a third flow rate, and a fourth flow assembly with a fourth flow rate, wherein when the first valve assembly is substantially open, the third flow rate is less than the first flow rate, and wherein when the second valve assembly is substantially open, the fourth flow rate is less than the second flow rate. The assembly also includes a second set of channels for connecting the third flow assembly and the first valve assembly to a first multi-zone injector zone. The assembly further includes a third set of channels for connecting the fourth flow assembly and the second valve assembly to a second multi-zone injector zone.Type: ApplicationFiled: September 30, 2004Publication date: March 30, 2006Inventors: Fangli Hao, John Daugherty, James Tappan
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Patent number: 6998095Abstract: A loop dilution system includes a dual-loop multi-way valve. In a first configuration of the multi-way valve, a first loop may be filled with a first solution and a second loop may be filled with a second solution. In a second configuration of the multi-way valve, the first and second loops are serially connected with a pump so that their contents may be mixed with a diluent. In another aspect of the invention, an in-process mass spectrometry (IPMS) system is disclosed that uses an internal standard to determine the concentration of an analyte in a sample. The internal standard has a different molecular composition than the analyte but is sufficiently similar chemically and physically to the analyte such that it behaves substantially the same as the analyte during an ionization process in the mass spectrometer.Type: GrantFiled: August 15, 2003Date of Patent: February 14, 2006Assignee: Metara, Inc.Inventors: Marc R. Anderson, Michael J. West, James Tappan