Abstract: A metal oxide semiconductor (MOS)-based power device includes a semiconductor region, drain and source electrodes, a gate electrode separated from the semiconductor region by SiO2, where the channel length (CHL) has a range of between about 0.6 ?m and about 0.5 ?m, the silicon dioxide has a corresponding thickness (tox) range of between about 5 nm to about 30 nm, where the CHL has a range of between about 0.5 ?m and about 0.4 ?m, the tox has a corresponding range of between about 5 nm to about 25 nm, where the CHL has a range of between about 0.4 ?m and about 0.3 ?m, the tox has a corresponding range of between about 5 nm to about 20 nm, where the CHL has a range of between about 0.3 ?m and about 0.2 ?m, the tox has a corresponding range of between about 5 nm to about 15 nm.

Abstract: A silicon carbide (SiC) metal oxide semiconductor (MOS) power device is disclosed which includes an SiC drain semiconductor region, an SiC drift semiconductor region coupled to the SiC drain semiconductor region, an SiC base semiconductor region coupled to the SiC drift semiconductor region, an SiC source semiconductor region coupled to the SiC base semiconductor region, a source electrode coupled to the SiC source semiconductor region, a drain electrode coupled to the SiC drain semiconductor region, a gate electrode, wherein voltage of the gate electrode with respect to the SiC base semiconductor region is less than or equal to about 12 V and thickness of the dielectric material is such that the electric field in the dielectric material is about 4 MV/cm when said gate voltage is about 12 V.

Abstract: A power semiconductor device includes a silicon carbide substrate and has at least a first layer or region formed above the substrate. The silicon carbide substrate has a pattern of pits formed thereon. The power semiconductor device further includes an ohmic metal disposed at least in the pits to form low-resistance ohmic contacts. Each pit of the pattern of pits has a depth that extends short of the first layer.

Abstract: A power semiconductor device includes a silicon carbide substrate and at least a first layer or region formed above the substrate. The silicon carbide substrate has a pattern of pits formed thereon. The device includes a stop layer that is disposed at least in part laterally between the pits. The device further comprising an ohmic metal disposed at least in the pits to form low-resistance ohmic contacts, wherein the ohmic metal contacts at least parts of the stop layer.

Abstract: A power semiconductor device includes a silicon carbide substrate and at least a first layer or region formed above the substrate. The silicon carbide substrate has a pattern of pits formed thereon. The device includes a stop layer that is disposed at least in part laterally between the pits. The device further comprising an ohmic metal disposed at least in the pits to form low-resistance ohmic contacts, wherein the ohmic metal contacts at least parts of the stop layer.

Abstract: A metal-oxide-semiconductor (MOS) power device includes a drain semiconductor region, a drift semiconductor region coupled to the drain semiconductor region, a base semiconductor region coupled to the drift semiconductor region and isolated by the drift semiconductor region from the drain semiconductor region, a source semiconductor region coupled to the base semiconductor region, a source electrode, a drain electrode, a gate electrode provided adjacent at least a portion of but isolated from the drift semiconductor region by a dielectric material, wherein the dielectric material has a thickness between 1 nm and 30 nm multiplied by a correction factor defined as a ratio of dielectric permittivity of the dielectric material and the permittivity of silicon dioxide, and wherein the device is configured to withstand greater than 100 V between the drain electrode and the source electrode when substantially no current is flowing through the drain electrode.

Abstract: A power semiconductor device includes a silicon carbide substrate and at least a first layer or region formed above the substrate. The silicon carbide substrate has a pattern of pits formed thereon. The device further comprising an ohmic metal disposed at least in the pits to form low-resistance ohmic contacts.

Abstract: A power semiconductor device includes a silicon carbide substrate and at least a first layer or region formed above the substrate. The silicon carbide substrate has a pattern of pits formed thereon. The device further comprising an ohmic metal disposed at least in the pits to form low-resistance ohmic contacts.

Abstract: A power semiconductor device includes a silicon carbide substrate and at least a first layer or region formed above the substrate. The silicon carbide substrate has a pattern of pits formed thereon. The device further comprising an ohmic metal disposed at least in the pits to form low-resistance ohmic contacts.

Abstract: A power semiconductor device includes a silicon carbide substrate and at least a first layer or region formed above the substrate. The silicon carbide substrate has a pattern of pits formed thereon. The device further comprising an ohmic metal disposed at least in the pits to form low-resistance ohmic contacts.

Abstract: An insulated gate field effect transistor is disclosed. The transistor includes a semi-insulating silicon carbide substrate, an epitaxial layer of silicon carbide layer adjacent the semi-insulating substrate for providing a drift region having a first conductivity type, and source and drain regions in the epitaxial layer having the same conductivity type as the drift region. A channel region is in the epitaxial layer, has portions between the source and the drain regions, and has the opposite conductivity type from the source and drain regions. The transistor includes contacts to the epitaxial layer for the source, drain and channel regions, an insulating layer over the channel region of the epitaxial layer, and a gate contact adjacent the insulating layer and the channel region.

Abstract: A silicon carbide insulated gate power transistor is disclosed that demonstrates increased maximum voltage. The transistor comprises a field effect or insulated gate transistor with a protective region adjacent the insulated gate that has the opposite conductivity type from the source for protecting the gate insulator material from the degrading or breakdown effects of a large voltage applied across the device.

Abstract: An apparatus and a method for regenerating charge packets representing logical information in a charge transfer device uses a pattern of field plate electrodes and impurity zones to perform arithmetic operations. To regenerate a charge packet it is first multiplied by a factor dependent upon transfer imperfections. Then an amount of charge representing a logical 0 is substracted from the charge packet. Finally, the magnitude of the charge packet is limited to the amount of charge representing a logical 1.