Abstract: A modular smart packaging case comprising reversibly attachable electronics and detection modules is disclosed. The detection module includes a sensor array for monitoring the state of a blister pack containing a plurality of product units. The electronics module contains the high-value electronics required to read the sensors of the array, process the sensor output, and enable communications to and from the case. The electronics module and detection module are operatively coupled via a universal interface that enables the same electronics module to operate with a plurality of detection modules of different configurations. In some embodiments, the electronics module operatively couples with multiple detection modules.

Abstract: A modular smart packaging case comprising reversibly attachable electronics and detection modules is disclosed. The detection module includes a sensor array for monitoring the state of a blister pack containing a plurality of product units. The electronics module contains the high-value electronics required to read the sensors of the array, process the sensor output, and enable communications to and from the case. The electronics module and detection module are operatively coupled via a universal interface that enables the same electronics module to operate with a plurality of detection modules of different configurations. In some embodiments, the electronics module operatively couples with multiple detection modules.

Abstract: A modular smart packaging case comprising reversibly attachable electronics and detection modules is disclosed. The detection module includes a sensor array for monitoring the state of a blister pack containing a plurality of product units. The electronics module contains the high-value electronics required to read the sensors of the array, process the sensor output, and enable communications to and from the case. The electronics module and detection module are operatively coupled via a universal interface that enables the same electronics module to operate with a plurality of detection modules of different configurations. In some embodiments, the electronics module operatively couples with multiple detection modules.

Abstract: A modular smart packaging case comprising reversibly attachable electronics and detection modules is disclosed. The detection module includes a sensor array for monitoring the state of a blister pack containing a plurality of product units. The electronics module contains the high-value electronics required to read the sensors of the array, process the sensor output, and enable communications to and from the case. The electronics module and detection module are operatively coupled via a universal interface that enables the same electronics module to operate with a plurality of detection modules of different configurations. In some embodiments, the electronics module operatively couples with multiple detection modules.

Abstract: A probe card for wafer-level testing a plurality of optoelectronic devices on a wafer is provided. The probe card has both electrical and optical functionality. The probe card comprises a plurality of lenslets aligned with the plurality of optoelectronic devices to improve the optical coupling efficiency between each of the plurality of optoelectronic devices and a plurality of optical waveguides located on a probe head.

Abstract: A probe card for wafer-level testing a plurality of optoelectronic devices on a wafer is provided. The probe card has both electrical and optical functionality. The probe card comprises a plurality of lenslets aligned with the plurality of optoelectronic devices to improve the optical coupling efficiency between each of the plurality of optoelectronic devices and a plurality of optical waveguides located on a probe head.

Abstract: The specification describes an improved Moving Anti-Reflection Switch (MARS) device structure that largely eliminates charge build up on the movable membrane, and reduces stresses that cause curling of the membrane. The improved device uses a movable membrane made of single crystal silicon.

Abstract: In accordance with the invention, a tunable, reconfigurable optical add-drop filter comprises a pair of optical waveguides optically coupled by a microring or microdisk resonator wherein the coupling distance between the resonator and at least one of the waveguides is micromechanically controllable. With this arrangement, the degree of coupling can be tuned after fabrication to provide high level extinction of dropped wavelengths and the filter can be dynamically reconfigured. Advantageously, laser radiation is provided to tune the resonant wavelength.

Abstract: In accordance with the invention, a electromechanical optical modulator comprising an optical membrane, a substrate and Fabry-Perot air gap between them is provided with an improved structure for controlling light transmitted into the substrate. Specifically, an etched and coated cavity is formed in the backwall of the substrate underlying the air gap to receive transmitted light and redirect it onto controllable paths within the substrate. Advantageously the substrate is silicon, and the cavity is produced by anisotropic etching.

Abstract: In accordance with the invention, a WDM optical communication system includes a new tunable multi-channel dispersion compensating filter having low loss, low polarization dependence and capable of compensating many channels over a large wavelength range. In essence, the filter comprises an optical cavity with a near 100% reflector on one side and a variable partial reflector on the other side. The device acts as a tunable all-pass filter.

Abstract: In accordance with the invention, a WDM optical communication system includes a new tunable multi-channel dispersion compensating filter having low loss, low polarization dependence and capable of compensating many channels over a large wavelength range. In essence, the filter comprises an optical cavity with a near 100% reflector on one side and a variable partial reflector on the other side. The device acts as a tunable all-pass filter.

Abstract: In accordance with the invention, a tunable, reconfigurable optical add-drop filter comprises a pair of optical waveguides optically coupled by a microring or microdisk resonator wherein the coupling distance between the resonator and at least one of the waveguides is micromechanically controllable. With this arrangement, the degree of coupling can be tuned after fabrication to provide high level extinction of dropped wavelengths and the filter can be dynamically reconfigured. Advantageously, laser radiation is provided to tune the resonant wavelength.

Abstract: The specification describes an improved Moving Anti-Reflection Switch (MARS) device structure that largely eliminates charge build up on the movable membrane, and reduces stresses that cause curling of the membrane. The improved device uses a movable membrane made of single crystal silicon.

Abstract: An integrated semiconductor device is formed from two fabricated semiconductor devices each having a substrate by placing an etch-resist on the substrate of the one semiconductor device, by bonding the conductors of one of the fabricated semiconductor devices to the conductors of the other fabricated semiconductor device, flowing an uncured cement (e.g. epoxy) between the etch-resist and the other substrate, allowing the cement to solidify, and removing the substrate from the one of the semiconductor devices. More specifically, a hybrid semiconductor device is formed from a GaAs/AlGaAs multiple quantum well modulator having a substrate and an IC chip having a substrate by placing an etch resist on the modulator substrate, bonding the conductors of the modulator to the conductors of the chip, wicking an uncured epoxy between the modulators and the chip, allowing the epoxy to cure, and removing the substrate from the modulator.

Abstract: A simple method for making large, uniformly flat electrostatically actuated micro-mirrors for use as variable attenuators and switches in optical networking systems is disclosed. The devices are fabricated by fusion bonding ultra-thin, single crystal silicon wafers to micromachined silicon substrates, forming robust, non-deforming reflective surfaces which are simpler to fabricate than similar devices fabricated by conventional chemical vapor deposition of polycrystalline silicon, which require careful engineering to avoid stress-induced deformation.

Abstract: First and second wafers are micromachined by standard integrated-circuit fabrication techniques to respectively make first and second component parts of a variable capacitor. A thin flexible membrane in the first wafer is integral with and mechanically supported by the first wafer. A metal pattern on the first wafer includes a first capacitor plate on the membrane. In the second wafer, a well is formed. A metal pattern on the second wafer includes a second capacitor plate in the well. By bonding the two parts together face-to-face, the capacitor plates are positioned in spaced-apart alignment with each other. External electrical connections to the plates are made via bonding-pad portions of the metal patterns on the wafers. In response to electrical control signals, the metal plate on the membrane can be moved toward the other plate, thereby selectively changing the capacitance of the assembly.

Abstract: In accordance with the present invention, apparatus for and method of operating an optical signal monitor is disclosed for providing rapid monitoring of optical signals using a high speed optical modulator. One illustrative optical signal monitor includes (1) a Mechanical AntiReflective Switch (MARS) optical modulator (signal chopper) capable of operating at 10 MHz rates and having a detection bandwidth greater than 100 kHz and (2) a synchronous detector using lock-in detection in a 1550 nm-band WDM optical monitor to enhance detection sensitivity by greater than 30 dB compared to direction detection methods. According to another embodiment, the optical monitor can be used to control adaptive optical amplifier units or equalizer units of a wavelength division multiplexed (WDM) system.

Abstract: An optical assembly for detecting an optical signal from a signal source in systems where the intensity of the optical signal may surpass the operational range of the optical detector being used. The optical assembly includes an optical detector for converting the optical input signal into a corresponding electrical output signal. The optical detector has a set operational range of input signal intensities. An attenuator is disposed between the optical detector and the signal source. The attenuator is capable of reducing the signal intensity of the optical signal if required so that the optical signal falls within the operational range of the optical detector. A controller is electronically coupled to both the optical detector and the attenuator. The controller controls the attenuator as a function of the output signal of the optical detector, wherein the attenuator attenuates the optical signal to fall within the operational range of the optical detector.

Abstract: An integrated semiconductor device is formed from two fabricated semiconductor devices each having a substrate by placing an etch-resist on the substrate of the one semiconductor device, by bonding the conductors of one of the fabricated semiconductor devices to the conductors of the other fabricated semiconductor device, flowing an uncured cement (e.g. epoxy) between the etch-resist and the other substrate, allowing the cement to solidify, and removing the substrate from the one of the semiconductor devices. More specifically, a hybrid semiconductor device is formed from a GaAs/AlGaAs multiple quantum well modulator having a substrate and an IC chip having a substrate by placing an etch resist on the modulator substrate, bonding the conductors of the modulator to the conductors of the chip, wicking an uncured epoxy between the modulators and the chip, allowing the epoxy to cure, and removing the substrate from the modulator.

Abstract: A method for designing an integrated circuit having optical inputs and outputs includes the step of selecting an integrated circuit design which includes at least one circuit cell design for processing electric signals. The circuit cell design has a predetermined number of electric inputs and electric outputs. The integrated circuit design also includes a plurality of layers of metalization for providing electric coupling. After the electronic integrated circuit design is selected, a predetermined number of optical input devices are located on the circuit cell design in a first prearranged orientation. The predetermined number of optical input devices is no greater than the predetermined number of electric inputs to the circuit cell. Also after the electronic circuit design is selected, a predetermined number of optical output devices are located on the circuit cell design in a second prearranged orientation.