Abstract: The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists of the a disk comprising a plurality of abrasive segments, each of which is fixed in tangential and radial relationship to one another about the common axis of rotation of the conditioning disk. Means are provided for movement of the abrasive segments, individually or in sets, into or out of the plane of the active abrasive surface of the conditioning disk according to the present invention.

Abstract: The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists of the a disk comprising a plurality of abrasive segments, each of which is fixed in tangential and radial relationship to one another about the common axis of rotation of the conditioning disk. Means are provided for movement of the abrasive segments, individually or in sets, into or out of the plane of the active abrasive surface of the conditioning disk according to the present invention.

Abstract: The present invention utilizes a combination of chemical and mechanical finishing processes to polish a disk substrate surface to near atomic smoothness. Broadly speaking, the surface of a disk substrate that has been machined (i.e., rough ground) to a predetermined surface roughness is subjected to attack by a chemical formulation (called an attacking agent). The chemical formulation is used to soften the substrate material. Then, the softened material is “wiped away” via mechanical action.

Abstract: The present invention utilizes a combination of chemical and mechanical finishing processes to polish a disk substrate surface to near atomic smoothness. Broadly speaking, the surface of a disk substrate that has been machined (i.e., rough ground) to a predetermined surface roughness is subjected to attack by a chemical formulation (called an attacking agent). The chemical formulation is used to soften the substrate material. Then, the softened material is “wiped away” via mechanical action.

Abstract: The invention is a method of plating a nonmetallic substrate comprising the steps of depositing an adhesion enhancing film on the substrate, treating the adhesion enhancing film to make the film catalytic, and forming an outer coating and passivating plate on the adhesion enhancing film. The resulting plated, nonmetallic substrates may comprise any number of materials used as an inner substrate such as compounds of oxide, nitride, phosphide, carbide, glass, ceramic, and mixtures thereof. In use, the resulting substrate may find application in any number of data storage and retrieval application.

Abstract: The invention is a method of plating a nonmetallic substrate comprising the steps of depositing an adhesion enhancing film on the substrate, treating the adhesion enhancing film to make the film catalytic, and forming an outer coating and passivating plate on the adhesion enhancing film. The resulting plated, nonmetallic substrates may comprise any number of materials used as an inner substrate such as compounds of oxide, nitride, phosphide, carbide, glass, ceramic, and mixtures thereof. In use, the resulting substrate may find application in any number of data storage and retrieval application.