Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: A method and computer processor system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry, such as, a high-performance cell processor complex, and a design structure on which the subject circuit resides are provided. The computer system includes predefined processor circuits including anti-tamper logic. A volume container substantially contains the predefined processor circuits including the anti-tamper logic. A heat spreader is provided with the predefined processor circuits within the volume container. An external heatsink structure is attached to an outside cover above the volume container. The heatsink structure includes a heatsink base and a plurality of parallel fins extending outwardly from the heatsink base. A heat pipe extending through a folded mesh is attached to the heat spreader within the volume container and is attached to the external heatsink base providing an effective heat removal path for the processor circuits.

Abstract: An assembly for dissipating heat generated by electronic components which include a ventilating panel having a plurality of vent holes arranged thereon. More specifically, the perforation pattern of vent holes is staggered to provide adjacent larger and smaller vent holes in at least two rows of vent holes. A second row of vent holes is staggered with respect to the first row of vent holes such that the larger vent holes are aligned with smaller vent holes, preferably in a ratio of two smaller vent holes per one larger vent hole. Such a perforation arrangement of vent holes may be provided on a blindswap cassette for securing and aligning computer cards for mounting in a housing, such as a sled for use in computer systems.

Abstract: A method and computer processor system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry, such as, a high-performance cell processor complex, and a design structure on which the subject circuit resides are provided. The computer system includes predefined processor circuits including anti-tamper logic. A volume container substantially contains the predefined processor circuits including the anti-tamper logic. A heat spreader is provided with the predefined processor circuits within the volume container. An external heatsink structure is attached to an outside cover above the volume container. The heatsink structure includes a heatsink base and a plurality of parallel fins extending outwardly from the heatsink base. A heat pipe extending through a folded mesh is attached to the heat spreader within the volume container and is attached to the external heatsink base providing an effective heat removal path for the processor circuits.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: An optical transceiver includes structures that define an electrical connector port for allowing connection of an electrical connector to an optical subassembly of the transceiver, and structures that define a vent surrounding at least portions of the connector port, whereby the vent allows bidirectional passage of air therethrough. Included in the transceiver are structures that define electromagnetic interference shielding and selectively transfer heat of heat generating electronic components by conduction to a transceiver housing. Methods of cooling the transceiver by ventilation and internal heat conduction are present.

Abstract: A method of cooling an optical transceiver that is mountable in a wall opening and a method of cooling a data transfer system in combination with an optical transceiver is described. An optical transceiver is provided that has a form factor and one end portion that is insertable within a wall opening in a wall. Ambient air is ventilated over a major surface portion of the optical transceiver by mounting said end portion to the wall opening so that at least one vent is formed within confines of the wall opening. The vent allows air to pass between the exterior and interior of the enclosure, and over the major surface portion of the optical transceiver.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: An acoustic door for an equipment enclosure, such as a rack mount cabinet, also provides a low impedance air flow uniformly delivered across the cabinet opening. A pair of metal panels, with acoustic foam along the rear surfaces, extend angularly outward and toward one another to form an air inlet opening between the outer edges. A central column is positioned between the panels which, in a horizontal section, forms an aerodynamic dome which has a continuously curved sheet metal surface at the front and sides that also captures a core of acoustic foam that is exposed at the rear. A rigid vane is disposed at each lateral side and parallel to the central column to cause air to follow the column surface, deflecting air behind the column and effecting uniform delivery of air flow across the cabinet front opening at the rear opening of the door.

Abstract: An optical transceiver includes structures that define an electrical connector port for allowing connection of an electrical connector to an optical subassembly of the transceiver, and structures that define a vent surrounding at least portions of the connector port, whereby the vent allows bidirectional passage of air therethrough. Included in the transceiver are structures that define electromagnetic interference shielding and selectively transfer heat of heat generating electronic components by conduction to a transceiver housing. Methods of cooling the transceiver by ventilation and internal heat conduction are present.

Abstract: An optical transceiver includes structures that define an electrical connector port for allowing connection of an electrical connector to an optical subassembly of the transceiver, and structures that define a vent surrounding at least portions of the connector port, whereby the vent allows bidirectional passage of air therethrough. Included in the transceiver are structures that define electromagnetic interference shielding and selectively transfer heat of heat generating electronic components by conduction to a transceiver housing. Methods of cooling the transceiver by ventilation and internal heat conduction are present.

Abstract: An optical transceiver includes structures that define an electrical connector port for allowing connection of an electrical connector to an optical subassembly of the transceiver, and structures that define a vent surrounding at least portions of the connector port, whereby the vent allows bidirectional passage of air therethrough. Included in the transceiver are structures that define electromagnetic interference shielding and selectively transfer heat of heat generating electronic components by conduction to a transceiver housing. Methods of cooling the transceiver by ventilation and internal heat conduction are present.