Abstract: A system and method for effectively performing a streamlined photo distribution procedure is disclosed. A source device initially captures a photographic image of a target or subject using known techniques. The term “photographic image” as used herein is not limited to single photographs but includes moving pictures, video images and any other known or future means of capturing an image of an event. The source device is likewise broadly defined and includes, but is not limited to, digital cameras, video cameras, cell phones with digital photo capture means, computers, including PDAs or other devices or combination of devices with communication and photo capture means, and other image capture means.

Abstract: A system and method for effectively performing a streamlined photo distribution procedure is disclosed. A source device initially captures a photographic image of a target or subject using known techniques. The term “photographic image” as used herein is not limited to single photographs but includes moving pictures, video images and any other known or future means of capturing an image of an event. The source device is likewise broadly defined and includes, but is not limited to, digital cameras, video cameras, cell phones with digital photo capture means, computers, including PDAs or other devices or combination of devices with communication and photo capture means, and other image capture means.

Abstract: A system and method for controlling the manufacture of semiconductor wafers using model predictive control is provided. In accordance with one embodiment, a tool output of the manufacturing tool is determined based on a first wafer run. Using the tool output, a tool input for a subsequent wafer run is determined by minimizing an optimization equation being dependent upon a model which relates tool output to tool process state and tool process state to tool input and previous tool process state. The tool input is then provided to the manufacturing tool for processing a second wafer run. In this manner, processing by the tool or tool age is taken into account in determining the tool input for a subsequent run. This can reduce variations in tool output from run-to-run and improve the characteristics of the ultimately formed semiconductor devices.