Patents by Inventor James B. Byrd

James B. Byrd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayered ceramic capacitor with improved lead frame attachment
    Patent number: 9799449
    Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: October 24, 2017
    Assignee: KEMET Electronics Corporation
    Inventors: R. Allen Hill, Philip M. Lessner, Reggie Phillips, Keith Brown, James B. Byrd
  • Multilayered Ceramic Capacitor with Improved Lead Frame Attachment
    Publication number: 20150036263
    Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.
    Type: Application
    Filed: September 26, 2014
    Publication date: February 5, 2015
    Inventors: R. Allen Hill, Philip M. Lessner, Reggie Phillips, Keith Brown, James B. Byrd
  • MULTILAYERED CERAMIC CAPACITOR WITH IMPROVED LEAD FRAME ATTACHMENT
    Publication number: 20130107419
    Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.
    Type: Application
    Filed: October 28, 2011
    Publication date: May 2, 2013
    Applicant: KEMET ELECTRONICS CORPORATION
    Inventors: R. Allen Hill, Philip M. Lessner, Reggie Phillips, Keith Brown, James B. Byrd