Abstract: An ultra-thin robust bondline of thermoplastic polyimide (TPI) adhesive is disposed directly between a layer of silicon and a metallic layer to create a silicon/metal monatomic baseplate providing a heat sink structure for mounting semiconductors in electronic circuits.

Abstract: An animal carcass cooking and roasting assembly and method of use in an oven, the assembly including a base tray, a liquid container mounted on and connected to the tray in a rack in a spaced apart upright position, the container arranged to receive a substantial amount of heat by conduction from the tray by the use of a tray and container connecting thermal via, the container arranged to fit within an open end of the carcass and wherein the opposite end of the carcass is tightly plugged or closed to form an isostatic chamber to contain liquid evaporated from the container within the carcass during the cooking process.

Abstract: An animal carcass cooking and roasting assembly and method of use in an oven, the assembly including a base tray, a liquid container mounted on and connected to the tray in a rack in a spaced apart upright position, the container arranged to receive a substantial amount of heat by conduction from the tray by the use of a tray and container connecting thermal via, the container arranged to fit within an open end of the carcass and wherein the opposite end of the carcass is tightly plugged or closed to form an isostatic chamber to contain liquid evaporated from the container within the carcass during the cooking process.

Abstract: A real-time method for determining zero-sum event probabilities for a selected contest between at least two participants, employing a computer connected to the internet, from reported betting odds from a betting market available on the internet which method includes determining event probability based on the relative inverse payout of the result's occurrence compared to the summed inverse payouts of that results' non-occurrence, i.e., competitive zero-sum results on a given betting platform.

Abstract: A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of particulate ceramic and/or metallic thermally conducting, electrically insulating, and thermally conducting, electrically conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures.

Abstract: A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of flat particulate inorganic ceramic and/or metallic electrically insulating, and/or electrically conducting, and/or thermally conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures, such particles resulting in the reduction of the occurrence and size of gas voids within the adhesive bondline.

Abstract: A process utilizing thermoplastic adhesives for surface mounting or laminating two or more substrate surfaces consisting of a combination of thermoplastic-polyimide (TPI) adhesive layers, one of which is B-staged or partially cured, and the other of which is C-Staged or fully cured, employed both as direct coatings and/or stand alone bondfilms, as well as their advantageous use in joining materials of mismatched Coefficients of Thermal Expansion (CTE).

Abstract: A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of flat particulate inorganic ceramic and/or metallic electrically insulating, and/or electrically conducting, and/or thermally conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures, such particles resulting in the reduction of the occurrence and size of gas voids within the adhesive bondline.

Abstract: A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of particulate ceramic and/or metallic thermally conducting, electrically insulating, and thermally conducting, electrically conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures.

Abstract: Thermoplastic Polyimide (TPI) polymer adhesive coated laminating films in which the TPI coating is under cured or B-staged as well as the process for preparing the films and the use thereof is disclosed.

Abstract: A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of particulate ceramic and/or metallic thermally conducting, electrically insulating, and thermally conducting, electrically conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures.

Abstract: A process utilizing thermoplastic adhesives for surface mounting or laminating two or more substrate surfaces consisting of a combination of thermoplastic-polyimide (TPI) adhesive layers, one of which is B-staged or partially cured, and the other of which is C-Staged or fully cured, employed both as direct coatings and/or stand alone bondfilms, as well as their advantageous use in joining materials of mismatched Coefficients of Thermal Expansion (CTE).

Abstract: Thermoplastic Polyimide (TPI) polymer adhesive coated laminating films in which the TPI coating is under cured or B-staged as well as the process for preparing the films and the use thereof is disclosed.

Abstract: Thermoplastic Polyimide (TPI) polymer adhesive coated laminating film in which the TPI coating is under cured or B-staged as well as the process for preparing the film is disclosed.

Abstract: A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of particulate ceramic and/or metallic thermally conducting, electrically insulating, and thermally conducting, electrically conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures.

Abstract: Thermoplastic Polyimide (TPI) polymer adhesive coated laminating film in which the TPI coating is under cured or B-staged as well as the process for preparing the film is disclosed.