Patents by Inventor James B. Hevel

James B. Hevel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230191541
    Abstract: A solder preform in the shape of a solder tube or washer includes: a cylindrically shaped solder alloy body including an inner surface, an outer surface, a first end, a second end, a first opening located at the first end, and a second opening located at the second end, the second end interlocking with the first end, and the first opening and the second opening cut along an entire height of the solder alloy body; and a flux core embedded in the solder alloy body between the inner surface and the outer surface, the flux core including a thermochromic indicator. During reflow soldering, the flux core including the thermochromic indicator flows out of the first opening of the first end and the second opening of the second end to coat the inner surface of the solder alloy body and the outer surface of the solder alloy body.
    Type: Application
    Filed: February 16, 2023
    Publication date: June 22, 2023
    Inventors: Craig K. Merritt, Anthony D. Lanza, JR., James B. Hevel
  • Patent number: 11602808
    Abstract: Some implementations of the disclosure are directed to a solder preform, comprising: a solder alloy body, the solder alloy body comprising at least one opening; and a flux core embedded in the solder alloy body, the flux core comprising a thermochromic indicator, wherein during reflow soldering, the flux core comprising the thermochromic indicator is configured to flow out of the at least one opening of the solder alloy.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: March 14, 2023
    Assignee: INDIUM CORPORATION
    Inventors: Craig K. Merritt, Anthony D. Lanza, Jr., James B. Hevel
  • Publication number: 20200346307
    Abstract: Some implementations of the disclosure are directed to a solder preform, comprising: a solder alloy body, the solder alloy body comprising at least one opening; and a flux core embedded in the solder alloy body, the flux core comprising a thermochromic indicator, wherein during reflow soldering, the flux core comprising the thermochromic indicator is configured to flow out of the at least one opening of the solder alloy.
    Type: Application
    Filed: April 29, 2020
    Publication date: November 5, 2020
    Inventors: Craig K. Merritt, Anthony D. Lanza, JR., James B. Hevel