Abstract: A method of fabricating a printed circuit board (PCB) including selectively etching copper foil at mapped areas corresponding to predefined radio-frequency (RF) signal performance of a device, for instance an active electrically scanned array (AESA). In embodiments, first and second RF performance areas of a device are mapped, the copper foil is etched at surface portions corresponding to the first RF performance areas to increase surface roughness, and the copper foil is bonded to a substate such that etched portions are aligned with the first RF performance areas of the PCB. In embodiments, the signal performance in the first RF performance areas is greater than the signal performance in the second RF performance areas.

Abstract: An electrical connector for high speed and high performance applications requiring protection against electrostatic discharge (ESD). In embodiments, the electrical connector includes a dielectric housing having a plurality of cavities descending from a top surface of the housing, a copper ground plate mounted atop or proximal to the top surface having a plurality of perforations corresponding in number and position to the plurality of cavities, and a plurality of electrical contacts each positioned at depth in one of the cavities such that the electrical contacts are recessed relative to the copper ground plate such that, in use of the electrical connector, a shortest path of ESD is to the copper ground plate and not any of the electrical contacts.

Abstract: A system of modular components each include pin ports that may be connected in different configurations to enact alternative planar designs. Each modular component has asymmetries that are utilized to facilitate alternative wiring. Such asymmetries could include protrusions in the wafer to align edge connections. Alternatively, or in addition, the asymmetries include differences in copper disposition to certain edge connections. Each modular component has a non-conductive coating on each side of the wafer to insulate the underlaying copper layer.

Abstract: A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.

Abstract: A phased array system includes an antenna system includes multiple antennas configured to transmit or receive signals and a power supply circuit configured to generate a supply power and provide the supply power to a plurality of distributed power supply circuits. The phased array system includes distributed power supply circuits, each of the plurality of distributed power supply circuits configured to receive the supply power from the power supply circuit and generate radio frequency supply powers for one multiple radio frequency circuits. The phased array system includes radio frequency circuits, each of the radio frequency circuits configured to cause one of the antennas to transmit or receive the signals based on the plurality of radio frequency supply powers.

Abstract: A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.

Abstract: A combined alternating current (AC) and direct current (DC) power converter is disclosed. In embodiments, the power converter includes an electromagnetic interference (EMI) filter, a bridge rectifier, and a boost converter. The EMI filter is configured to receive an electrical signal from a power source. The bridge rectifier is coupled to the EMI filter and includes at least four diodes arranged in a diode bridge configuration. The boost converter is coupled to the bridge rectifier and includes a switched DC path and a switched AC path. The switched DC path includes a DC transistor and the switched AC path includes an AC transistor. The switched AC path can also include one or more diodes and/or switching elements.

Abstract: A transportable, self-contained work site, designed specifically to facilitate manual vehicle washing and engine cleaning, comprising a rigid skeletal structure which is constructed of preformed, connectable modules and a lightweight raised platform or flooring which slopes inwardly to capture liquids for recycling.