Abstract: An audio system may include a plurality of sound reproduction devices characterized by parameter values; a plurality of audio signal sources characterized by parameter values; a plurality of remote control devices, a system controller, constructed and arranged to wirelessly receive command signals from the remote control devices and to wirelessly transmit parameter values of audio signal sources and of sound reproduction sources to the remote control device. The remote control devices are constructed and arranged for wirelessly transmitting command signals to the system controller and for wirelessly receiving parameter values and displaying parameter values. The remote control devices are being further constructed and arranged to transmit command signals to and receive parameter values from a system controller that is separated from remote control.

Abstract: An arrangement for interconnecting high density signals of integrated circuits provides minimal cross-talk, low noise and controlled impedance. A thermally conductive baseplate is used to support integrated circuit die in a multi-layered substrate. The integrated circuit die are thermally coupled to the baseplate, and the multi-layered substrate includes apertures therethrough for receiving the integrated circuit die. Tape automated bonding is used to connect leads on the integrated circuit die with conductors disposed on layers in the substrate. Other aspects of the arrangement include providing a power flex-connector and a signal flex-connector to connect the multi-layered substrate to an external power source and to a printed circuit board, respectively. To further minimize noise interference, the multi-layered substrate includes separate power and ground layers which are adjacent to one another.