Abstract: A method for combining a semiconductor device with a printed circuit board or substrate which eliminates the need for conventional semiconductor packaging and connectors for same on the board and thereby makes possible a relatively small and thin assembly adaptable for space limited electronic products. The semiconductor device is fixed to a carrier which is installed and secured within a hold in the circuit board. Terminal pads of the device are wire bonded to terminals on the substrate, and the connecting wires and die are completely encapsulated within a plastic material.

Abstract: An assembly of electronic components and a method of packaging such components to form a solid state time-keeping device capable of being housed in watch cases having different external configurations. The assembly includes a sub-assembly component which combines and interconnects an integrated semiconductor device with other discrete elements required to perform basic timing function in a compact package. This sub-assembly and the various other electronic components are readily removable and interchangeably replaceable with simple jeweler's hand tools.