Patents by Inventor James B. Svacha

James B. Svacha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LOW SHRINK POLYESTER FILMS AND METHOD OF MAKING
    Publication number: 20220234276
    Abstract: A method for making low shrink polyester films wherein the films are arranged in stacks, tentered, heat treated, and relaxed in unison. Also, polyester films produced by such method.
    Type: Application
    Filed: April 19, 2022
    Publication date: July 28, 2022
    Inventors: John P. Purcell, James B. Svacha, Stephen A. Johnson, Timothy J. Lindquist, Grant F. Tiefenbruck, Chad R. Wold
  • LOW SHRINK POLYESTER FILMS AND METHOD OF MAKING
    Publication number: 20210237336
    Abstract: A method for making low shrink polyester films wherein the films are arranged in stacks, tentered, heat treated, and relaxed in unison. Also, polyester films produced by such method.
    Type: Application
    Filed: December 28, 2016
    Publication date: August 5, 2021
    Inventors: JOHN P. PURCELL, JAMES B. SVACHA, STEPHEN A. JOHNSON, TIMOTHY J. LINDQUIST, GRANT F. TIEFENBRUCK, CHAD R. WOLD
  • MULTI-LAYER ISOTROPIC FILMS HAVING TOUGHNESS, HIGH TEMPERATURE PERFORMANCE, AND UV ABSORPTION
    Publication number: 20200156355
    Abstract: Multi-layer films, and processes to make the films, that enable the delivery of a substrate featuring a peelable thin layer of low haze, amorphous, isotropic film with the desired properties of high modulus, high usage temperature, UV blockage, and toughness The films are made using a co-extrusion, co-orientation and annealing process to enable the delivery of a thin isotropic, UV blocking layer on top of a release layer and support substrate. These film constructions can be kept together during additional processing steps such as coating and converting. The release and dimensionally stable substrate layer can be easily removed once processing steps are completed.
    Type: Application
    Filed: August 8, 2018
    Publication date: May 21, 2020
    Inventors: Stephen A. Johnson, Derek W. Patzman, Richard Yufeng Liu, Victor Ho, Timothy J. Hebrink, Kevin T. Huseby, John F. VanDerlofske, III, John P. Purcell, William T. Fay, James B. Svacha, Richard J. Thompson, Timothy J. Lindquist, Kristopher J. Derks