Abstract: A modular tile is disclosed configured to interlock with multiple tiles to form a modular floor covering over a floor. The tile includes improved grip and bounce characteristics. The tile may include an upper contact surface having rib with top edges that are sharp. Protrusions may extend from the upper contact surface to provide grip and increase ball bounce performance. The tile may be made of a composite of rigid plastic and rubber to improper bounce characteristics, including by increasing the degree to which the tile conforms with a subfloor.

Abstract: A modular floor tile is disclosed having a top surface including a plurality of upper rib members intersecting to form apertures. Lower rib members forming a downward trending curvilinear shape traverse the apertures. Rib protrusions extend from the lower rib members through the aperture toward the top surface, and may terminate below, at or above the top surface to provide added traction.

Abstract: A method for preparing a film carrier for sputtering of IC units placed thereon, the method comprising the steps of: providing a carrier of IC units; removing said units from the carrier; delivering said IC units to a flipper; inverting and delivering said units to a sputtering film frame; placing the units on said sputtering film frame in an array having a pre-determined clearance about adjacent units.