Abstract: A tangential feed material processing chamber for a material processing system has an axis, an axially extending inlet opening, and an axially extending outlet opening which is circumferentially spaced from the inlet opening. An inner surface of the chamber has a first portion extending circumferentially from a first side of the inlet opening to a first side of the outlet opening, and a second portion extending from a second side of inlet opening to a second side of the outlet opening. The first and second surface portions are formed with different surface finishes. A rotor is mounted along the axis to impact and direct material entering the inlet to flow tangentially about the axis to the outlet. A material processing system is also provided.

Abstract: This invention relates to the field of firearms, and in particular to a bipod for supporting a firearm, particularly high-calibre weapons. A bipod for supporting a bipod for supporting a firearm having a barrel, the bipod comprising: two legs rotatably mounted at respective opposing ends of a yoke and moveable between folded, intermediate, and firing positions, an elongate support member extending rearwardly of the yoke, and attachment means for attaching the bipod to the firearm in which the elongate support member is fixed to the yoke, and the attachment means is pivotally mounted on the elongate support number to permit canting of the firearm about a longitudinal axis.

Abstract: A high temperature polyamide coating and a fastener coated with a composition that includes from about 60 wt. % to about 80 wt. % of an aliphatic polyamide having a repeating unit. The composition also includes from about 3 wt. % to about 9 wt. % of an epoxy based resin having a molecular weight in the range from about 525 to about 585, from about 4 wt. % to about 10 wt. % of a ceramic microsphere material and from about 2 wt. % to about 5 wt. % of a thermoplastic methacrylate binder, from about 4 wt. % to about 12 wt. % of crushed glass, from about 0.1 wt. % to about 1 wt. % of a polyamide with a secondary amino group as a curing agent, and the balance of an epoxy based curing agent.