Abstract: A sensor for ultrasonically measuring a portion of a structure having a temperature significantly above room-temperature, the sensor comprising: a high-temperature portion for intimate contact with the structure, the high-temperature portion comprising at least: at least one transducer for converting a first signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to a second signal; a low-temperature portion comprising at least: at least one digital sensor interface (DSI) to which the transducer is electrically connected, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals; a wireless interface for transmitting a digital signal based directly or indirectly on at least said A-scan signal; and a battery for powering the DSI and the wireless interface; and an elongated member containing one or more electrical conductors for conducting the firs

Abstract: A sensor for ultrasonically measuring a portion of a structure having a temperature significantly above room-temperature, the sensor comprising: a high-temperature portion for intimate contact with the structure, the high-temperature portion comprising at least: at least one transducer for converting a first signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to a second signal; a low-temperature portion comprising at least: at least one digital sensor interface (DSI) to which the transducer is electrically connected, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals; a wireless interface for transmitting a digital signal based directly or indirectly on at least said A-scan signal; and a battery for powering the DSI and the wireless interface; and an elongated member containing one or more electrical conductors for conducting the firs

Abstract: An ultrasound sensing system for monitoring the condition or integrity of a structure, comprising: a plurality of ultrasound sensors, each sensor being configured to receive at least one first electrical signal, transmit an ultrasound signal in response to said first electrical signal, receive at least one reflected ultrasound signal, and transmit a second electrical signal in response to said reflected ultrasound signal, said first and second electrical signals being analog; and at least one digital sensor interface (DSI) to which at least a portion of said sensors are connectable, said DSI being configured to transmit said first electrical signal and receive said second electrical signal, and to generate at least an A-scan signal based on said first and second electrical signals for each sensor, said DSI having a cellular transceiver for transmitting a cellular signal based directly or indirectly on at least said A-scan signal, said cellular signal including an address corresponding to said at least one DSI

Abstract: An ultrasound sensing system for monitoring the condition or integrity of a structure, comprising: a plurality of ultrasound sensors, each sensor being configured to receive at least one first electrical signal, transmit an ultrasound signal in response to said first electrical signal, receive at least one reflected ultrasound signal, and transmit a second electrical signal in response to said reflected ultrasound signal, said first and second electrical signals being analog; and at least one digital sensor interface (DSI) to which at least a portion of said sensors are connectable, said DSI being configured to transmit said first electrical signal and receive said second electrical signal, and to generate at least an A-scan signal based on said first and second electrical signals for each sensor, said DSI having a cellular transceiver for transmitting a cellular signal based directly or indirectly on at least said A-scan signal, said cellular signal including an address corresponding to said at least one DSI

Abstract: An ultrasound sensing system for monitoring the condition or integrity of a structure, comprising (a) a plurality of ultrasound sensors, each sensor being configured to receive at least one first electrical signal, transmit an ultrasound signal in response to the first electrical signal, receive at least one reflected ultrasound signal, and transmit a second electrical signal in response to the reflected ultrasound signal, the first and second electrical signals being analog; (b) at least one digital sensor interface (DSI) to which at least a portion of the sensors are connectable, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals for each sensor, the DSI having circuitry for transmitting a digital signal based directly or indirectly on at least the A-scan signal, the digital signal including an address corresponding to the at least one DSI; (c) a digital bus configured to

Abstract: A method of releasably adhering an ultrasonic sensor to a structure, the structure having an operating temperature range, the method comprising: applying a coupling agent between the structure and the sensor at an installation temperature, the coupling agent having a glass transition temperature (Tg) below the operating temperature range and below the installation temperature, the coupling agent being in a viscous/viscoelastic state over the operating temperature range; and urging the sensor against the structure with the coupling agent therebetween such that the sensor adheres to the structure.

Abstract: A sensor for ultrasonically measuring a portion of a structure having a temperature significantly above room-temperature, the sensor comprising: a high-temperature portion for intimate contact with the structure, the high-temperature portion comprising at least: at least one transducer for converting a first signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to a second signal; a low-temperature portion comprising at least: at least one digital sensor interface (DSI) to which the transducer is electrically connected, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals; a wireless interface for transmitting a digital signal based directly or indirectly on at least said A-scan signal; and a battery for powering the DSI and the wireless interface; and an elongated member containing one or more electrical conductors for conducting the firs

Abstract: A sensor for ultrasonically measuring a portion of a structure, the sensor comprising: a transducer for converting an analog transmit signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to an analog reflected signal; a housing integrated with the transducer and containing at least: a processor; a wireless data transmitter for transmitting wirelessly a data signal from the processor; a transmit and receive circuit for transmitting an analog transmit signal to the transducer in response to a transmit trigger from the processor, and for receiving an analog reflected signal from the transducer; an A/D converter for digitizing only a portion of the analog reflected signal in response to a sample trigger from the processor; a battery to supply power to the processor, the wireless data transmitter, the transmit and receive circuit, and the A/D converter; memory operatively connected to the processor and configured to instruct the processor to execute the following steps: repeat

Abstract: An ultrasound sensing system for monitoring the condition or integrity of a structure, comprising (a) a plurality of ultrasound sensors, each sensor being configured to receive at least one first electrical signal, transmit an ultrasound signal in response to the first electrical signal, receive at least one reflected ultrasound signal, and transmit a second electrical signal in response to the reflected ultrasound signal, the first and second electrical signals being analog; (b) at least one digital sensor interface (DSI) to which at least a portion of the sensors are connectable, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals for each sensor, the DSI having circuitry for transmitting a digital signal based directly or indirectly on at least the A-scan signal, the digital signal including an address corresponding to the at least one DSI; (c) a digital bus configured to

Abstract: An ultrasound sensing system for monitoring the condition or integrity of a structure, comprising (a) a plurality of ultrasound sensors, each sensor being configured to receive at least one first electrical signal, transmit an ultrasound signal in response to the first electrical signal, receive at least one reflected ultrasound signal, and transmit a second electrical signal in response to the reflected ultrasound signal, the first and second electrical signals being analog; (b) at least one digital sensor interface (DSI) to which at least a portion of the sensors are connectable, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals for each sensor, the DSI having circuitry for transmitting a digital signal based directly or indirectly on at least the A-scan signal, the digital signal including an address corresponding to the at least one DSI; (c) a digital bus configured to

Abstract: A method of monitoring defects in a structure, the method comprising the steps of: (a) detecting the potential for a defect in the structure using a first detection method; (b) identifying the location on the structure of the defect using a second detection method; (c) determining if the defect exceeds an allowable limit, and, if so, transmitting information that the structure needs to be repaired; (d) if the defect does not exceed the allowable limit, then monitoring the structure by applying permanently installed ultrasonic sensor to the location; and (e) after step (d), repeatedly performing step (c) until the defect exceeds the allowable limit.

Abstract: A method of releasably adhering an ultrasonic sensor to a structure, the structure having an operating temperature range, the method comprising: applying a coupling agent between the structure and the sensor at an installation temperature, the coupling agent having a glass transition temperature (Tg) below the operating temperature range and below the installation temperature, the coupling agent being in a viscous/viscoelastic state over the operating temperature range; and urging the sensor against the structure with the coupling agent therebetween such that the sensor adheres to the structure.

Abstract: A sensor for ultrasonically measuring a portion of a structure, the sensor comprising: a transducer for converting an analog transmit signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to an analog reflected signal; a housing integrated with the transducer and containing at least: a processor; a wireless data transmitter for transmitting wirelessly a data signal from the processor; a transmit and receive circuit for transmitting an analog transmit signal to the transducer in response to a transmit trigger from the processor, and for receiving an analog reflected signal from the transducer; an A/D converter for digitizing only a portion of the analog reflected signal in response to a sample trigger from the processor; a battery to supply power to the processor, the wireless data transmitter, the transmit and receive circuit, and the A/D converter; memory operatively connected to the processor and configured to instruct the processor to execute the following steps: repeat

Abstract: An ultrasound sensing system for monitoring the condition or integrity of a structure, comprising: a plurality of ultrasound sensors, each sensor being configured to receive at least one first electrical signal, transmit an ultrasound signal in response to said first electrical signal, receive at least one reflected ultrasound signal, and transmit a second electrical signal in response to said reflected ultrasound signal, said first and second electrical signals being analog; and at least one digital sensor interface (DSI) to which at least a portion of said sensors are connectable, said DSI being configured to transmit said first electrical signal and receive said second electrical signal, and to generate at least an A-scan signal based on said first and second electrical signals for each sensor, said DSI having a cellular transceiver for transmitting a cellular signal based directly or indirectly on at least said A-scan signal, said cellular signal including an address corresponding to said at least one DSI

Abstract: An ultrasound sensing system for monitoring the condition or integrity of a structure, comprising (a) a plurality of ultrasound sensors, each sensor being configured to receive at least one first electrical signal, transmit an ultrasound signal in response to the first electrical signal, receive at least one reflected ultrasound signal, and transmit a second electrical signal in response to the reflected ultrasound signal, the first and second electrical signals being analog; (b) at least one digital sensor interface (DSI) to which at least a portion of the sensors are connectable, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals for each sensor, the DSI having circuitry for transmitting a digital signal based directly or indirectly on at least the A-scan signal, the digital signal including an address corresponding to the at least one DSI; (c) a digital bus configured to

Abstract: A method for performing ultrasonic testing comprising, in one embodiment, the steps of firing an ultrasonic transducer to generate an ultrasonic pulse that passes through a delay line, measuring a delay echo time of flight, and determining the temperature of the delay line using the delay echo time of flight, thereby eliminating the need for additional temperature measuring devices. Other embodiments further comprise the step of using the temperature of the delay line to determine the temperature of a test object, and using the temperature of the test object to determine a thickness of the test object that is compensated for thermal expansion and temperature dependent ultrasonic velocity.

Abstract: A method for performing ultrasonic testing comprising, in one embodiment, the steps of firing an ultrasonic transducer to generate an ultrasonic pulse that passes through a delay line, measuring a delay echo time of flight, and determining the temperature of the delay line using the delay echo time of flight, thereby eliminating the need for additional temperature measuring devices. Other embodiments further comprise the step of using the temperature of the delay line to determine the temperature of a test object, and using the temperature of the test object to determine a thickness of the test object that is compensated for thermal expansion and temperature dependent ultrasonic velocity.

Abstract: A method of inspecting a component includes immersing the component in a coupling medium with material velocity cw and immersing an ultrasonic (UT) probe having at least one transducer in the coupling medium. The UT probe has a convex lens with acoustic velocity cL and an acoustic impedance less than about 2.5×106 Rayls. The method further includes exciting the transducer to produce an UT pulse directed into the component and generating echo signals using the transducer as a receive element. An US inspection system includes UT probe, a pulser/receiver configured to supply signal excitation pulses to the transducer element at a pulse repetition frequency (prf) of at least about 1000 Hz and a scanner configured to scan the component with the UT probe at a scanning rate equal to the prf times a scanning increment.

Abstract: In accordance with one embodiment, the present technique provides a testing apparatus for testing material integrity of an object. The exemplary testing apparatus includes a phased array transducer, which is disposed external to the object. The phased array transducer is configured to transmit a first set of ultrasonic signals and to receive a second set of ultrasonic signals. The testing apparatus further includes logic circuitry coupled to the phased array transducer. The logic circuitry is configured to dynamically control apertures for transmitting the first set of ultrasonic signals and receiving the second set of ultrasonic signals based on a region of interest and a testing speed.

Abstract: The present disclosure provides for the application of a two-dimensional ultrasonic phased array (100), formed of a plurality of transducers (102) arranged in a rectilinear pattern, for material and volumetric component testing. The two-dimensional array enables electronic adjustment of the focal properties and size of the aperture in both the azimuthal and elevational directions such that uniform and/or specified sound field characteristics can be obtained at any or all locations in the component being tested.