Patents by Inventor James Beckert

James Beckert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10790108
    Abstract: Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: September 29, 2020
    Assignee: Littelfuse, Inc.
    Inventors: James Beckert, Gregory Stumpo
  • Publication number: 20190221396
    Abstract: Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.
    Type: Application
    Filed: March 26, 2019
    Publication date: July 18, 2019
    Applicant: Littelfuse, Inc.
    Inventors: James Beckert, Gregory Stumpo
  • Patent number: 10283304
    Abstract: Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: May 7, 2019
    Assignee: LITTELFUSE, INC.
    Inventors: James Beckert, Gregory Stumpo