Patents by Inventor James Bernard Dunlop, JR.

James Bernard Dunlop, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING ELECTRODE ARRAY ASSEMBLY HAVING INTEGRATED CIRCUITS
    Publication number: 20190321627
    Abstract: A method of manufacturing an electrode array is provided. The electrode array is configured to be applied against living tissue. The method comprises providing a flexible sheet that has a plurality of conductors. A plurality of integrated circuits are mounted to the flexible sheet so that the plurality of integrated circuits are bonded to the plurality of conductors. Electrodes are provided over the plurality of integrated circuits.
    Type: Application
    Filed: July 2, 2019
    Publication date: October 24, 2019
    Applicant: Stryker Corporation
    Inventors: John J. Janik, Robert A. Brindley, James Bernard Dunlop, JR., Leland Joseph Spangler, Edward Chia-Ning Tang
  • Implantable electrode array assembly with an array substrate, electrodes and integrated circuits, the integrated circuits being attached to package substrates
    Patent number: 10046158
    Abstract: An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: August 14, 2018
    Assignee: STRYKER CORPORATION
    Inventors: John Janik, Rob Brindley, Edward Chia-Ning Tang, James Bernard Dunlop, Jr., Leland Joseph Spangler
  • Implantable electrode array assembly including a carrier, superstrates mounted to the carrier and electrodes disposed on the superstrates
    Patent number: 8554340
    Abstract: An implantable electrode array (40, 310) that includes multiple spaced apart electrodes (42, 316) to which current can be individually sourced and sunk. The array includes a carrier (80, 312) that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in windows (81, 404) within the carrier.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: October 8, 2013
    Assignee: Stryker Corporation
    Inventors: John Janik, Rob Brindley, Edward Chia-Ning Tang, James Bernard Dunlop, Jr., Leland Joseph Spangler
  • IMPLANTABLE ELECTRODE ARRAY ASSEMBLY WITH AN ARRAY SUBTRATE, ELECTRODES AND INTEGRATED CIRCUITS, THE INTEGRATED CIRCUITS BEING ATTACHED TO PACKAGE SUBSTRATES
    Publication number: 20120330393
    Abstract: An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.
    Type: Application
    Filed: June 8, 2012
    Publication date: December 27, 2012
    Inventors: John Janik, Rob Brindley, Edward Chia-Ning Tang, James Bernard Dunlop, JR., Leland Joseph Spangler
  • IMPLANTABLE ELECTRODE ARRAY ASSEMBLY INCLUDING A CARRIER FOR SUPPORTING THE ELECTRODES AND CONTROL MODULES FOR REGULATING OPERATION OF THE ELECTRODES EMBEDDED IN THE CARRIER, AND METHOD OF MAKING SAME
    Publication number: 20120310316
    Abstract: An implantable electrode array (40, 310) that includes multiple spaced apart electrodes (42, 316) to which current can be individually sourced and sunk. The array includes a carrier (80, 312) that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in windows (81, 404) within the carrier.
    Type: Application
    Filed: February 2, 2012
    Publication date: December 6, 2012
    Inventors: John Janik, Rob Brindley, Edward Chia-Ning Tang, James Bernard Dunlop, JR., Leland Joseph Spangler