Abstract: The disclosure includes an apparatus and a method for forming a frozen substance using directional freezing. The apparatus includes a mold and a directional freezing assembly. The mold is structured with an interior chamber structured to contain a liquid substance. The directional freezing assembly includes a directional freezing probe and a cold plate. The directional freezing probe extends into the interior chamber of the mold and initiates directional freezing of the liquid substance surrounding the directional freezing probe. The cold plate is connected to the directional freezing probe outside of the mold and dissipates heat drawn from the directional freezing probe to a surrounding environment.

Abstract: The disclosure includes an apparatus and a method for forming a frozen substance using directional freezing. The apparatus includes a mold and a directional freezing assembly. The mold is structured with an interior chamber structured to contain a liquid substance. The directional freezing assembly includes a directional freezing probe and a cold plate. The directional freezing probe extends into the interior chamber of the mold and initiates directional freezing of the liquid substance surrounding the directional freezing probe. The cold plate is connected to the directional freezing probe outside of the mold and dissipates heat drawn from the directional freezing probe to a surrounding environment.

Abstract: A thermoelectric module is provided that includes a first thermally conductive plate with a first array of thermoelectric elements coupled to it. The first array of thermoelectric elements includes a first plurality of thermoelectric elements. The thermoelectric module also includes a second thermally conductive plate coupled to the first array of thermoelectric elements, and a second array of thermoelectric elements coupled to the second plate. The second array of thermoelectric elements includes a second plurality of thermoelectric elements. A third thermally conductive plate is coupled to the second array of thermoelectric elements. The thermoelectric module also includes a portion of each thermoelectric element of the first and second pluralities of thermoelectric elements being coplanar with at least a portion of every other thermoelectric element of the first and second pluralities of thermoelectric elements.

Abstract: A thermoelectric device is provided that includes a top plate with surface including a first and second portion. A first plurality of thermoelectric elements are coupled to the first portion, and a second plurality of thermoelectric elements are coupled to the second portion. A base plate is coupled to the first and second plurality of thermoelectric elements. The first and second plurality of thermoelectric elements are operable to transfer thermal energy from the top plate to the base plate when an electrical current is passed through the first and second plurality of thermoelectric elements. The second plurality of thermoelectric elements receives a higher electrical current density than the first plurality of thermoelectric elements, and the second plurality of thermoelectric elements transfer more thermal energy per unit area of the top plate than the first plurality of thermoelectric elements.

Abstract: In accordance with one embodiment of the present invention, a method of manufacturing a thermoelectric device is disclosed. The method includes forming a wafer of thermoelectric material and coupling the wafer to a stiff backing such that a bottom side of the wafer faces the stiff backing and a top side of the wafer faces away from the stiff backing. The method also includes reducing a thickness of the wafer by removing a portion of the wafer from the top side, and dicing the wafer into a plurality of blocks. At least a portion of the plurality of blocks are then coupled with a permanent substrate.